Chip on Board: Technology for Multichip Modules - Rilegato

Lau, John H.

 
9780442014414: Chip on Board: Technology for Multichip Modules
Rilegato
ISBN 10: 0442014414 ISBN 13: 9780442014414
Casa editrice: SPRINGER NATURE, 1994

Sinossi

A guide to the COB technology. It is suitable for professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Contenuti

Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index

Product Description

Book by Lau John H

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Editore
SPRINGER NATURE
Data di pubblicazione
1994
Lingua
Inglese
ISBN 10 
0442014414
ISBN 13 
9780442014414
Rilegatura
Copertina rigida
Numero di pagine
556
Contatto del produttore
non disponibile
Persona responsabile
ProductSafety@springernature.com
ProductSafety@springernature.com

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