Chip on Board: Technology for Multichip Modules - Rilegato

Lau, John H.

Rilegato

ISBN 10: 0442014414 ISBN 13: 9780442014414

Casa editrice: SPRINGER NATURE, 1994

Riassunto

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Su questo libro

Contenuti

Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index

Product Description

Book by Lau John H

Dettagli dell'edizione

• Editore: SPRINGER NATURE
• Data di pubblicazione: 1994
• Lingua: Inglese
• ISBN 10: 0442014414
• ISBN 13: 9780442014414
• Rilegatura: Copertina rigida
• Numero di pagine: 556
• Contatto del produttore: non disponibile
• Persona responsabile: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3,69115 Heidelberg, Germany; Heidelberg; 69115; Germania