Articoli correlati a Chip on Board Technologies for Multichip Modules: Technology...
Sinossi
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Contenuti
Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index
Product Description
Book by Lau John H
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
- EditoreKluwer Academic Pub
- Data di pubblicazione1994
- ISBN 10 0442014414
- ISBN 13 9780442014414
- RilegaturaCopertina rigida
- LinguaInglese
- Numero di pagine556
- RedattoreLau John H.
- Contatto del produttorenon disponibile
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) [Hardcover] Lau, John H.
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Chip on Board: Technology for Multichip Modules
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Gebunden. Condizione: New. This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and. Codice articolo 458435639
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
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Chip on Board : Technology for Multichip Modules
Da: AHA-BUCH GmbH, Einbeck, Germania
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Buch. Condizione: Neu. Neuware - This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. Codice articolo 9780442014414
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