Articoli correlati a Chip on Board Technologies for Multichip Modules: Technology...
Sinossi
This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Contenuti
Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index
Product Description
Book by Lau John H
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
- EditoreKluwer Academic Pub
- Data di pubblicazione1994
- ISBN 10 0442014414
- ISBN 13 9780442014414
- RilegaturaCopertina rigida
- LinguaInglese
- Numero di pagine556
- RedattoreLau John H.
- Contatto del produttorenon disponibile
Compra nuovo
Visualizza questo articolo
EUR 143,52
EUR 25,97 per la spedizione da U.S.A. a Italia
Destinazione, tempi e costiRisultati della ricerca per Chip on Board Technologies for Multichip Modules: Technology...
Immagini fornite dal venditore
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Da: Bay State Book Company, North Smithfield, RI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: acceptable. The book is complete and readable, with all pages and cover intact. Dust jacket, shrink wrap, or boxed set case may be missing. Pages may have light notes, highlighting, or minor water exposure, but nothing that affects readability. May be an ex-library copy and could include library markings or stickers. Codice articolo BSM.IM4G
Quantità: 1 disponibili
Foto dell'editore
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Da: Toscana Books, AUSTIN, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks. Codice articolo Scanned0442014414
Quantità: 1 disponibili
Foto dell'editore
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering) [Hardcover] Lau, John H.
Da: GridFreed, North Las Vegas, NV, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: New. In shrink wrap. Codice articolo 20-11566
Quantità: 1 disponibili
Immagini fornite dal venditore
Chip on Board: Technology for Multichip Modules
Da: moluna, Greven, Germania
Valutazione del venditore 5 su 5 stelle
Gebunden. Condizione: New. This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and. Codice articolo 458435639
Quantità: Più di 20 disponibili
Foto dell'editore
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
Condizione: New. In. Codice articolo ria9780442014414_new
Quantità: Più di 20 disponibili
Foto dell'editore
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Da: dsmbooks, Liverpool, Regno Unito
Valutazione del venditore 4 su 5 stelle
Hardcover. Condizione: Like New. Like New. book. Codice articolo D7F7-3-M-0442014414-6
Quantità: 1 disponibili
Immagini fornite dal venditore
Chip on Board : Technology for Multichip Modules
Da: AHA-BUCH GmbH, Einbeck, Germania
Valutazione del venditore 5 su 5 stelle
Buch. Condizione: Neu. Neuware - This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. Codice articolo 9780442014414
Quantità: 2 disponibili