This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Preface; Acknowledgments; A brief introduction to wire bonding, tape automated bonding, and flip chip on board for multichip module applications; Making COB testing tractable: chip pretest and system diagnostics; Chip level interconnect; wire bonding for multichip modules; Chip level interconnect: wafer bumping and inner lead bonding; Chip level interconnect: solder bumped flip chip; Chip attachment; Wire bonding chip on board; Tape automated bonding chip on board and on MCM-D; Solder bumped flip chip attach on SLC board and multichip module; Micron bump bonding chip on board; chip on board encapsulation; Underfill encapsulation for flip chip applications; Index
Book by Lau John H
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
EUR 51,70 per la spedizione da U.S.A. a Italia
Destinazione, tempi e costiEUR 25,85 per la spedizione da U.S.A. a Italia
Destinazione, tempi e costiDa: Bay State Book Company, North Smithfield, RI, U.S.A.
Condizione: acceptable. The book is complete and readable, with all pages and cover intact. Dust jacket, shrink wrap, or boxed set case may be missing. Pages may have light notes, highlighting, or minor water exposure, but nothing that affects readability. May be an ex-library copy and could include library markings or stickers. Codice articolo BSM.IM4G
Quantità: 1 disponibili
Da: Toscana Books, AUSTIN, TX, U.S.A.
Hardcover. Condizione: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks. Codice articolo Scanned0442014414
Quantità: 1 disponibili
Da: GridFreed, North Las Vegas, NV, U.S.A.
Hardcover. Condizione: New. In shrink wrap. Codice articolo 20-11566
Quantità: 1 disponibili
Da: moluna, Greven, Germania
Gebunden. Condizione: New. This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and. Codice articolo 458435639
Quantità: Più di 20 disponibili
Da: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9780442014414_new
Quantità: Più di 20 disponibili
Da: dsmbooks, Liverpool, Regno Unito
Hardcover. Condizione: Like New. Like New. book. Codice articolo D7F7-3-M-0442014414-6
Quantità: 1 disponibili
Da: AHA-BUCH GmbH, Einbeck, Germania
Buch. Condizione: Neu. Neuware - This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection. Codice articolo 9780442014414
Quantità: 2 disponibili