Design and Application of Intelligent Thermally Conductive Materials - Brossura

Wei, Feng

Brossura

ISBN 10: 0443404097 ISBN 13: 9780443404092

Casa editrice: Elsevier Science Ltd, 2025

Riassunto

Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. It provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity.

For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.

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Informazioni sull'autore

Prof. Wei Feng is a full professor at the School of Materials Science and Engineering, Tianjin University, China. He received his Ph.D. from Xi’an Jiaotong University in 2000. His research focuses on functional polymers and their composites.

A recipient of the National Science Fund for Distinguished Young Scholars, he has authored or co-authored several books and peer-reviewed papers in high-impact journals. He currently serves as Chairman of the Committee on Thermoconductive Composite Materials of the Chinese Society for Composite Materials.

Dalla quarta di copertina

Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The focus on intelligent thermally conductive materials sets the book apart from other works, which deal with traditional materials. The book provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity. For all readers, including researchers, industry professionals and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. While the potential future demand for these materials is enormous, the author indicates where developmental, technical and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation.

Dettagli dell'edizione

• Editore: Elsevier Science Ltd
• Data di pubblicazione: 2025
• Lingua: Inglese
• ISBN 10: 0443404097
• ISBN 13: 9780443404092
• Rilegatura: Copertina flessibile
• Numero edizione: 1
• Numero di pagine: 900
• Contatto del produttore: ELSEVIER; https://www.elsevier.com/es-es; ; Mooswaldallee 6; Freiburg; 79108; Germania