Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.
Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Spese di spedizione:
EUR 48,99
Da: Germania a: U.S.A.
Descrizione libro Condizione: New. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming test and try out method to obtain the best solution. Modeling and sim. Codice articolo 446913643
Descrizione libro Condizione: New. Codice articolo ABLING22Oct1916240147616
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Descrizione libro Condizione: New. Buy with confidence! Book is in new, never-used condition. Codice articolo bk0470827807xvz189zvxnew
Descrizione libro Condizione: New. New! This book is in the same immaculate condition as when it was published. Codice articolo 353-0470827807-new
Descrizione libro Condizione: New. Codice articolo I-9780470827802
Descrizione libro Condizione: New. Codice articolo 11676207-n