Modeling and Simulation for Packaging Assembly: Manufacture, Reliability and Testing

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9780470827802: Modeling and Simulation for Packaging Assembly: Manufacture, Reliability and Testing

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. * Models and simulates numerous processes in manufacturing, reliability and testing for the first time * Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing * Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products * Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects * Appendix and color images available for download from the book's companion website

Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.

Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

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Liu, Yong, Liu, Sheng
Editore: Wiley-Blackwell (2011)
ISBN 10: 0470827807 ISBN 13: 9780470827802
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Descrizione libro Wiley-Blackwell, 2011. Hardcover. Condizione libro: New. New: These book are brand-new, unused, unread and in perfect condition. Most items will be dispatched the same or the next working day. Codice libro della libreria mon0002332174

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Sheng Liu
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Descrizione libro Wileyand#8211;Blackwell, 2011. HRD. Condizione libro: New. New Book. Shipped from UK in 4 to 14 days. Established seller since 2000. Codice libro della libreria FW-9780470827802

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Sheng Liu, Yong Liu
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Descrizione libro John Wiley and Sons Ltd, United States, 2011. Hardback. Condizione libro: New. 1. Auflage. 250 x 174 mm. Language: English . Brand New Book. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming test and try out method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. * Models and simulates numerous processes in manufacturing, reliability and testing for the first time * Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing * Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products * Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects * Appendix and color images available for download from the book s companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at. Codice libro della libreria AAH9780470827802

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Sheng Liu, Yong Liu
Editore: John Wiley and Sons Ltd, United States (2011)
ISBN 10: 0470827807 ISBN 13: 9780470827802
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[?]

Descrizione libro John Wiley and Sons Ltd, United States, 2011. Hardback. Condizione libro: New. 1. Auflage. 250 x 174 mm. Language: English . Brand New Book. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming test and try out method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. * Models and simulates numerous processes in manufacturing, reliability and testing for the first time * Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing * Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products * Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects * Appendix and color images available for download from the book s companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at. Codice libro della libreria AAH9780470827802

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Descrizione libro Wiley, 2011. Hardcover. Condizione libro: New. book. Codice libro della libreria 0470827807

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Descrizione libro John Wiley and Sons. Condizione libro: New. Brand New. Codice libro della libreria 0470827807

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Descrizione libro Wiley, 2011. Condizione libro: new. Shiny and new! Expect delivery in 20 days. Codice libro della libreria 9780470827802-1

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Descrizione libro 2011. Hardcover. Condizione libro: New. 1st. 254mm x 174mm x. Hardcover. Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming te.Shipping may be from multiple locations in the US or from the UK, depending on stock availability. 592 pages. 1.136. Codice libro della libreria 9780470827802

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Descrizione libro Wiley, 2011. Hardcover. Condizione libro: New. 1. Codice libro della libreria DADAX0470827807

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Descrizione libro John Wiley & Sons Inc, 2011. Hardcover. Condizione libro: Brand New. har/psc edition. 564 pages. 10.00x7.00x1.25 inches. In Stock. Codice libro della libreria __0470827807

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