Integrated Passive Component Technology - Rilegato

Rilegato

ISBN 10: 0471244317 ISBN 13: 9780471244318

Casa editrice: IEEE, 2003

Riassunto

• This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
• Describes the processes available for creating integrated passives, measuring their properties, and applying them.
• Brings reader up to date in a fast-moving technology.
• Enables reader to implement the technology into a manufacturing environment.
• Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
• Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.

Su questo libro

Recensione:

"...a comprehensive look at the reasons and current challenges...[of integrating] passive devices into board or IC...just the right dose of the math to explain the physics and theory behind the technology." (IEEE Circuits & Devices Magazine, Jan/Feb 2005)
 
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)

"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)

L'autore:

RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society’s Dielectric Science and Technology Division.

LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

Su questa edizione

• Editore: IEEE
• Data di pubblicazione: 2003
• ISBN 10: 0471244317
• ISBN 13: 9780471244318
• Rilegatura: Copertina rigida
• Numero edizione: 1
• Numero di pagine: 450
• Redattore: Ulrich Richard K., Schaper Leonard W.