Articoli correlati a Semiconductor Wafer Bonding: Science and Technology

Semiconductor Wafer Bonding: Science and Technology - Rilegato

Tong, Q. Y.; Gosele, U.; Electrochemical Society

 
9780471574811: Semiconductor Wafer Bonding: Science and Technology
Rilegato
ISBN 10: 0471574813 ISBN 13: 9780471574811
Casa editrice: Wiley-Interscience, 1998

Sinossi

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers

Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.

This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others.

For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Informazioni sull'autore

Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics.

U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.

Dalla quarta di copertina

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers

Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.

This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others.

For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Editore
Wiley-Interscience
Data di pubblicazione
1998
Lingua
Inglese
ISBN 10 
0471574813
ISBN 13 
9780471574811
Rilegatura
Copertina rigida
Numero di pagine
297
Contatto del produttore
Wiley VCH Verlag GmbH
info@wiley-vch.de

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