This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.
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Electrical Engineering/Circuits and Electron Devices Routing in the Third Dimension From VLSI to MCMs Naveed Sherwani, Siddharth Bhingarde, and Anand Panyam A volume in the IEEE Press Series on Microelectronic Systems Stuart K. Tewksbury, Series Editor The complex computer chips of tomorrow will consist of not just one or two but several layers of metal interconnect. This makes the interconnect within a chip or a multichip module a three-dimensional problem. This book addresses the algorithmic and cell design issues in chip and MCM routing, with an emphasis on techniques for eliminating routing area. Key features include:
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