Microelectronic Materials and Processes: 164 - Rilegato

Rilegato

ISBN 10: 0792301471 ISBN 13: 9780792301479

Casa editrice: SPRINGER NATURE, 1989

Riassunto

The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes.

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Contenuti

1 Silicon Crystal Growth.- 1.1 Introduction.- 1.2 Growth Characteristics.- 1.3 Impurity Incorporation.- 1.4 Trends in Large-Diameter Silicon Growth.- 1.5 Conclusions.- 2 Silicon Epitaxy.- 2.1 Introduction.- 2.2 EPI Equipment.- 2.3 Deposition.- 2.4 Doping.- 2.5 Autodoping.- 2.6 Pattern Shift.- 2.7 Defects.- 2.8 EPI Characterization.- 2.9 Conclusions.- 3 Silicon Oxidation.- 3.1 Introduction.- 3.2 Oxide Formation.- 3.3 Silicon Dioxide Properties.- 3.4 Conclusions.- 4 Physical Vapor Deposition.- 4.1 Introduction.- 4.2 Deposition Methods.- 4.3 Alloys and Compounds.- 4.4 Film Properties.- 4.5 Conclusions.- 5 Chemical Vapor Deposition.- 5.1 Introduction.- 5.2 Some Basic Aspects of CVD.- 5.3 Types of CVD Processes.- 5.4 Production CVD Reactor Systems.- 5.5 Deposition of Various Materials for VLSI Device Fabrication.- 5.6 Conclusions.- 6 Dielectric Materials.- 6.1 Introduction.- 6.2 Dielectric and Insulator Materials and their Applications in VLSI Technology.- 6.3 Methods of Film Formation and Equipment.- 6.4 Vertical Insulation in VLSI Technology.- 6.5 High Temperature Interconductor Insulation.- 6.6 Low Temperature Intermetal Insulation.- 6.7 Over-Metal Passivation Layer.- 6.8 Conclusions.- 7 Properties and Applications of Suicides.- 7.1 Introduction.- 7.2 Properties.- 7.3 Formation of Suicides and their Processing.- 7.4 Process Stability of Silicides-Resistivity, Stress and Device Reliability.- 7.5 Limitations.- 7.6 Conclusions.- 8 Forefront of Photolithographic Materials.- 8.1 Introduction.- 8.2 Extending Positive Resist Performance in the UV Region.- 8.3 Negative Resist Materials Which Do Not Swell During Development.- 8.4 Image Reversal Techniques.- 8.5 Contrast Enhancing Materials (CEMs).- 8.6 Amplification in Photoresist Technology.- 8.7 Deep UV Resists.- 8.8 Multilevel Resist Technology and Planarization.- 8.9 Bilayer Resist Processes.- 8.10 Gas-Phase-Functionalized Plasma-Developed Resists.- 8.11 Conclusions.- 9 Fine-Line Lithography.- 9.1 Introduction.- 9.2 Basic Fabrication Processes and Ultimate Resolution.- 9.3 UV Shadow Printing.- 9.4 X-Ray Lithography.- 9.5 Ion and Electron Beam Proximity Printing.- 9.6 Optical Projection.- 9.7 Scanning Electron Beam Lithography.- 9.8 Scanning Ion Beam Lithography.- 9.9 Conclusions.- 10 Dry Etching Processes.- 10.1 Introduction.- 10.2 RF Glow Discharges (Plasmas).- 10.3 Etching Considerations.- 10.4 Profile Control.- 10.5 Process Monitoring (Diagnostics).- 10.6 Other Dry Etch Techniques.- 10.7 Radiation Damage.- 10.8 Safety Considerations.- 10.9 Conclusions.- 11 Ion Implantation.- 11.1 Introduction.- 11.2 Ion Implanters.- 11.3 Range Distributions.- 11.4 Ion Damage.- 11.5 Annealing of Implanted Dopant Impurities.- 11.6 Ion Beam Annealing.- 11.7 Conclusions.- 12 Diffusion in Semiconductors.- 12.1 Introduction.- 12.2 Phenomenological Description.- 12.3 Point Defects and Atomistic Diffusion Mechanisms.- 12.4 Diffusion in Silicon.- 12.5 Diffusion in Germanium.- 12.6 Diffusion in Gallium Arsenide.- 12.7 Conclusions.- 13 Interconnect Materials.- 13.1 Introduction.- 13.2 Material and Process Requirements for VLSI Technology.- 13.3 Gate Metallization.- 13.4 Metal-Silicon Contacts.- 13.5 Interconnect Lines.- 13.6 Conclusions.- 14 Imperfection and Impurity Phenomena.- 14.1 Introduction.- 14.2 Imperfections and Impurities.- 14.3 Electrical Phenomena.- 14.4 Defect-Free Processing.- 14.5 Conclusions.- 15 Process Simulation.- 15.1 Introduction.- 15.2 Epitaxy.- 15.3 Ion Implantation.- 15.4 Diffusion.- 15.5 Lithography.- 15.6 Conclusions.- 16 Diagnostic Techniques.- 16.1 Introduction.- 16.2 Physical Background of Diagnostic Techniques.- 16.3 Analytical Aspects of Diagnostic Techniques.- 16.4 Areas of Application of Diagnostic Techniques.- 16.5 Specific Features and Applications of the Different Methods.- 16.6 Conclusions.- 16.7 Explanation of Acronyms and Abbreviations.

Product Description

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Dettagli dell'edizione

• Editore: SPRINGER NATURE
• Data di pubblicazione: 1989
• Lingua: Inglese
• ISBN 10: 0792301471
• ISBN 13: 9780792301479
• Rilegatura: Copertina rigida
• Numero di pagine: 1000
• Redattore: Levy R. A.
• Contatto del produttore: non disponibile
• Persona responsabile: Palgrave Macmillan; ProductSafety@springernature.com; ; Crinan Street 4; London; N1 9XW; Regno Unito