It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Foreword. Preface. Acknowledgments. Part I: Getting Started. 1. Introduction. 2. An Approach to MEMS Design. 3. Microfabrication. 4. Process Integration. Part II: Modeling Strategies. 5. Lumped Modeling. 6. Energy-Conserving Transducers. 7. Dynamics. Part III: Domain-Specific Details. 8. Elasticity. 9. Structures. 10. Energy Methods. 11. Dissipation and the Thermal Energy Domain. 12. Lumped Modeling of Dissipative Processes. 13. Fluids. Part IV: Circuit and System Issues. 14. Electronics. 15. Feedback Systems. 16. Noise. Part V: Case Studies. 17. Packaging. 18. A Piezoresistive Pressure Sensor. 19. A Capacitive Accelerometer. 20. Electrostatic Projection Displays. 21. A Piezoelectric Rate Gyroscope. 22. DNA Amplification. 23. A Microbridge Gas Sensor. Appendices: A. Glossary of Notation. B. Electromagnetic Fields. C. Elastic Constants in Cubic Material. References. Index.
Book by Senturia Stephen D
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
Da: booksdeck, Santa clara, CA, U.S.A.
Softcover. Condizione: NEW. Brand new book. International edition printed overseas but with similar contents as compared to the US edition. Same day shipping with tracking. Codice articolo 692|9780792372462
Quantità: 1 disponibili
Da: Textbooks_Source, Columbia, MO, U.S.A.
hardcover. Condizione: Good. 1st ed. 2000. Corr. 2nd printing 2004. Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes). Codice articolo 000500459U
Quantità: 10 disponibili
Da: Better World Books, Mishawaka, IN, U.S.A.
Condizione: Very Good. design Edition. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. Codice articolo 12986980-6
Quantità: 1 disponibili
Da: BIBLIOPE by Calvello Books, Oakland, CA, U.S.A.
Hardcover. Condizione: Very good(+). Octavo in brown boards; illus. 689 p., 24 cm. Very good(+) with lightly bumped boards; no internal markings, highlights, pen. Price sticker residue on back boards. Else tight copy; pages are clean, crisp and free of creases; binding is tight and square. Codice articolo 84244
Quantità: 1 disponibili
Da: Books From California, Simi Valley, CA, U.S.A.
Hardcover. Condizione: Fine. Codice articolo mon0003656454
Quantità: 3 disponibili
Da: GoldBooks, Denver, CO, U.S.A.
Condizione: new. Codice articolo 49V61_95_0792372468
Quantità: 1 disponibili
Da: Studibuch, Stuttgart, Germania
hardcover. Condizione: Befriedigend. 715 Seiten; 9780792372462.4 Gewicht in Gramm: 2. Codice articolo 882354
Quantità: 3 disponibili
Da: DeckleEdge LLC, Albuquerque, NM, U.S.A.
hardcover. Condizione: new. Codice articolo Shelfdream0792372468
Quantità: 1 disponibili
Da: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9780792372462_new
Quantità: Più di 20 disponibili
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Condizione: New. Codice articolo ABLIING23Feb2416190184336
Quantità: Più di 20 disponibili