Articoli correlati a Benefiting from Thermal and Mechanical Simulation in...
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Main areas covered are:-
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Contenuti:
Preface. Simulation overview in the industry; B. Schwarz. Thermal & mechanical problems in microelectronics; O.F. Slattery, G. Kelly, J. Greer. Solder material characterization and modelling; S. Wiese, F. Feustel, E. Meusel. Polymer material characterisation and modelling; L.J. Ernst. Generic issues in numerical modeling; S. Pulko. Modeling of vapor pressure during reflow for electronic packages; X.J. Fan. Simulation for fatigue, cracks and delamination; R. Dudek, J. Auersperg, B. Michel. Experimental validation of finite element modeling; D. Vogel, C. Jian, I. De Wolf. Perspectives of non-linear simulation; M.A. Crisfield, A.J. Burton. Simulation-based optimisation in virtual thermo-mechanical prototyping of electronic packages; G.Q. Zhang, H.P. Stehouwer. Thermal fatigue reliability optimisation of Flip-Chip assemblies; B. Vandevelde, E. Beyne. Product and Process Optimization with simulation; D. den Hertog, P. Stehouwer.
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
- EditoreKluwer Academic Pub
- Data di pubblicazione2000
- ISBN 10 0792372786
- ISBN 13 9780792372783
- RilegaturaCopertina rigida
- Numero di pagine192
- RedattoreZhang G. Q., Ernst L. J., De Saint Leger O.
Compra nuovo
Scopri di più su questo articolo
EUR 106,57
Spese di spedizione:
GRATIS
In U.S.A.
I migliori risultati di ricerca su AbeBooks
Immagini fornite dal venditore
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics [Hardcover ]
Da:
Valutazione libreria
Descrizione libro Hardcover. Condizione: new. Codice articolo 9780792372783
Compra nuovo
EUR 106,57
Convertire valuta
Foto dell'editore
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Da:
Valutazione libreria
Descrizione libro Condizione: New. Codice articolo ABLIING23Feb2416190184358
Compra nuovo
EUR 111,11
Convertire valuta
Foto dell'editore
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Print on Demand
Da:
Valutazione libreria
Descrizione libro Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book. Codice articolo ria9780792372783_lsuk
Compra nuovo
EUR 112,71
Convertire valuta
Immagini fornite dal venditore
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Editore:
Springer US
(2000)
ISBN 10: 0792372786
ISBN 13: 9780792372783
Nuovo
Rilegato
Quantità: > 20
Da:
Valutazione libreria
Descrizione libro Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software c. Codice articolo 5970046
Compra nuovo
EUR 92,27
Convertire valuta
Immagini fornite dal venditore
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Da:
Valutazione libreria
Descrizione libro Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics. Codice articolo 9780792372783
Compra nuovo
EUR 113,89
Convertire valuta
Foto dell'editore
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Print on Demand
Da:
Valutazione libreria
Descrizione libro Hardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days. Codice articolo C9780792372783
Compra nuovo
EUR 138,99
Convertire valuta
Immagini fornite dal venditore
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Editore:
Springer US Dez 2000
(2000)
ISBN 10: 0792372786
ISBN 13: 9780792372783
Nuovo
Rilegato
Quantità: 2
Da:
Valutazione libreria
Descrizione libro Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics. 208 pp. Englisch. Codice articolo 9780792372783
Compra nuovo
EUR 185,06
Convertire valuta