Covering materials, processes, equipment, methodologies, characterization techniques, clean room practices, and ways to control contamination-related defects, this work offers up-to-date information on the application of interconnection technology to semiconductors. It offers an integration of technical, patent and industry literature.
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Methods and principles of deposition and etching of thin films; characterization; semiconductor contact technology; interlevel dielectrics; metallization; chip integration; reliability; contamination - defect control in multilevel interconnection manufacturing.
Book by Scwartz Geraldine Schwartz
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