Microwave Materials and Applications: 2 Volume Set - Rilegato

Rilegato

ISBN 10: 1119208521 ISBN 13: 9781119208525

Casa editrice: John Wiley & Sons Inc, 2017

Riassunto

The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics.

Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications

Chapters examine:

• Oxide ceramics for dielectric resonators and substrates
• HTCC, LTCC and ULTCC tapes for substrates
• Polymer ceramic composites for printed circuit boards
• Elastomer-ceramic composites for flexible electronics
• Dielectric inks
• EMI shielding materials
• Microwave ferrites

A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties.

Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.

Su questo libro

Informazioni sull?autore

Edited by
M. T. Sebastian Faculty of Information Technology and Electrical Engineering, University of Oulu, Finland

Rick Ubic Micron School of Materials Science and Engineering, Boise State University, USA

Heli Jantunen Faculty of Information Technology and Electrical Engineering, University of Oulu, Finland

Dalla quarta di copertina

The recent rapid progress in wireless telecommunication, including the Internet of Things, fifth generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics.

Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications.

Chapters examine:

• Oxide ceramics for dielectric resonators and substrates
• HTCC, LTCC, and ULTCC tapes for substrates
• Polymer ceramic composites for printed circuit boards
• Elastomer–Ceramic composites for flexible electronics
• Dielectric inks
• EMI shielding materials
• Microwave ferrites

A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties.

Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.

Dettagli dell?edizione

• Editore: John Wiley & Sons Inc
• Data di pubblicazione: 2017
• Lingua: Inglese
• ISBN 10: 1119208521
• ISBN 13: 9781119208525
• Rilegatura: Copertina rigida
• Numero di pagine: 927
• Redattore: Sebastian Mailadil T., Ubic Rick, Jantunen Heli
• Contatto del produttore: non disponibile
• Persona responsabile: non disponibile