Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis - Rilegato

Jamnia, Ali

Rilegato

ISBN 10: 1420065319 ISBN 13: 9781420065312

Casa editrice: CRC Press, 2008

Riassunto

As the demand for packaging more electronic capabilities into smaller packages rises, product developers must be more cognizant of how the system configuration will impact its performance. Practical Guide to the Packaging of Electronics: Second Edition, Thermal and Mechanical Design and Analysis provides a basic understanding of the issues that concern the field of electronics packaging. First published in 2003, this book has been extensively updated,   includes more detail where needed, and provides additional segments for clarification.

This volume supplies a solid foundation for heat transfer, vibration, and life expectancy calculations. Topics discussed include various modes of heat removal, such as conduction, radiation, and convection; the impact of thermal stresses; vibration and the resultant stresses; shock management; mechanical, electrical, and chemically induced reliability; and more. Unlike many other available works, it neither assumes the reader’s familiarity with the subject nor is it so basic that the reader may lose interest.

Dr. Ali Jamnia has published a large number of engineering papers and presentations and is the holder of a number of patents and patent applications. He has been involved in the issues of electronics packaging since the early ‘90s and since 1995 has worked toward the development of innovative electronics systems to aid individuals with physical or cognitive disabilities.

By consulting this manual, engineers, program managers, and quality assurance managers involved in electronic systems gain a fundamental grasp of the issues involved in electronics packaging, learn how to define guidelines for a system’s design, develop the ability to identify reliability issues and concerns, and are able to conduct more complete analyses for the final design.

Su questo libro

Contenuti:

INTRODUCTION
Issues in Electronics Packaging Design      
Technical Management Issues        
Electronics Design    
Packaging / Enclosure Design          
Reliability      
BASIC HEAT TRANSFER: CONDUCTION, CONVECTION AND RADIATION
Basic Equations and Concepts         
General Equations    
Non Dimensional Groups     
Nusselt Number          
Grashof Number          
Prandtl Number           
Reynolds Number        
CONDUCTIVE COOLING
Thermal Resistance  
Sample Problem & Calculations           
Resistance Network    
Network Rules
Sample Problem & Calculations           
Comparison with Exact Results         
Assumptions
Temperature at Intermediate Points 
Exercise: IC Temperature Determination          
Heat Spreading         
Thermal Modeling
Example         
Applications    
Junction-to-Junction Case Resistance        
Contact Interface Resistance          
Modeling the Interface 
Exercise – Calculate the Component Temperature        
First Approach           
A Second Approach   
A Third Approach      
A Word on Edge Guides         
2-D or 3-D Heat Conduction
Thermal Conductance  
Example         
RADIATION COOLING
Factors Influencing Radiation
Surface Properties       
View Factor Calculations         
View Factor Calculations In Electronics Packages        
Examples and Illustrations   
Electronics Packaging Problem
Flow in a Vertical Open-ended Channel           
Cabinet Surface Temperature          
First Approach
Second Approach
FUNDAMENTALS OF CONVECTION COOLING
Introduction   
Flow Regimes, Types & Influences      
Free (or natural) convection 
Estimates of Heat Transfer Coefficient  
Solution Procedure    
High Altitudes
Board Spacing & Inlet-Outlet Openings           
Design Tips     
Cabinet Interior & Surface Temperature           
Calculating Surface Temperature     
Calculation of Internal Temperature 
Calculation of Component Temperature       
Fin Design     
Basic Procedure          
RF Cabinet Free Convection Cooling   
Analytical Approach                
Design Recommendations for This Example.     
A More Exact Procedure         
Forced Convection    
Direct Flow System Design      
Required Flow Rate   
Board Spacing & Configurations      
Flow Resistance         
Flow Networks          
Flow Rate Distribution Between Parallel Plates
Optimum Board Spacing and Heat flow        
System’s Impedance Curve     
Sample Problem         
Fan-Selection, and Fan Laws   
Fan Performance Curve        
Fan Networks
More on Fan Performance Curves    
Fan Laws       
Component Hot Spot  
Calculating hc Using Colburn Factor           
Calculating hc Using Flow Rate        
In-Direct Flow System Design
Resistance Network Representation
COMBINED MODES AS WELL AS TRANSIENT HEAT TRANSFER
Total System Resistance      
Time Dependent Temperature Variation    
Temperature Rise of an Electronic Module
BASICS OF VIBRATION AND ITS ISOLATION
Periodic and Harmonic Motions      
Free Vibration           
First Application          
Example         
Second Application     
Mode Shapes  
Damped Vibration
Impact of Damping    
Forced Vibration       
Engineering Applications          
Dynamic Magnification Factor  
Transmissibility
Phase Angle    
Vibration Through Base Excitation       
Example         
Vibration Isolation       
Example 1      
Example 2      
Applications to Electronics Enclosures  
Maximum Deflection 
Typical Transmissibility Values in Electronics Enclosures    
Maximum Desired PCB Deflection
Random Vibration
Vibration Terminology
Peak Value
Average Value
Mean Square Value
Root Mean Square (RMS)
Decibel
Octave
Spectral Density
Solution Techniques For Random Vibration
Excitation Spectrum
Equipment Response
Vibrations Due to Acoustics And Noise
Multiple Degree of Freedom Systems
BASICS OF SHOCK MANAGEMENT
Pulse Shock Isolation
Example 1
Example 2
System without Isolators
System with Isolators
Velocity Shock Isolation
Example
Maximum Desired PCB Deflection
Equipment Design      
INDUCED STRESSES
Forced Vibration
Sample Problem
Random Vibration
Probability of Failure
Example
Shock Environment
THE FINITE ELEMENT METHODS
Some Basic Definitions
THE FINITE ELEMENT ANALYSIS PROCEDURE
Finite Element Formulation
Formulation of Characteristic Matrix and Load Vector
Direct Approach
Variational (Energy) Approach
Weighted Residual Approach   
Finite Element Formulation of Dynamic Problems
Wave Propagation Type
Vibration Type
Methods of Solving This Equation: Example; Impact of Boundary Conditions; Uniform Bar
Finite Element Formulation of Heat Conduction     
CAD to FEA Considerations
CAD to FEA, Do’s and Do Not’s
Criteria for Choosing an Engineering Software
What types of Engineering programs are there?
Computer Aided Design (CAD) and Computer Aided Manufacturing (CAM)
Solid Mechanics and Stress Analysis - FEA Software
Fluid Mechanics and Heat Transfer - CFD Software
General Physics - CFD and/or FEA
Which Software should I choose?
Application
Complete Package     
User Interface, Manuals and Training
Customer Support
Quality Assurance (QA)
Maintenance
Error Reports and Bug Fixes
Software Performance Testing
Validation
Interfacing to Other Programs
MECHANICAL AND THERMOMECHANICAL CONCERNS
General Stress – Strain Relationship
Anisotropic Behavior   
Orthotropic Behavior   
Isotropic Behavior       
Material Behavior and The Stress - Strain Curve
Determining Deformations Under Application of General Loads  
Thermal Strains and Stresses
Thermal Strains And Deflections
Basic Equation
Die Attachments
IC Devices      
PCB Warpage
Some Tips In Avoiding Temperature Related Failures
Simplifications or Engineering Assumptions
Linear Elasticity
Geometric Simplifications
Example
Thickness Calculation Based Solely on Shear
Thickness Calculation Based Solely on Back Plate Deflection
MECHANICAL RELIABILITY
Failure Modes
Failures By Elastic Deflection
Failures by Extensive Yielding
Failures by Fracture
Progressive Failures
Life Expectancy        
Life Expectancy for Pure Fatigue Conditions    
Example
Life Expectancy for In Random Vibration
Example
Life Expectancy for Pure Creep Conditions
Life Expectancy for Creep-Fatigue Interactions
Example 1
Example 2
ELECTRICAL RELIABILITY
Basic Definitions
Reliability Models
Exponential Distribution Model
Example 1
Example 2
Weibull Distribution
Example
Temperature, Electrical and Environmental Impacts on Reliability
Temperature Effects
Accelerated Testing
Electrical Stress Effects
Environmental Factors
System Failure Rate
Component Failure Rate
System Failure Rate
Example
CHEMICALLY INDUCED RELIABILITY
Electrochemical Attacks
Corrosion
Galvanic Cells
Stress Cells
Fretting Corrosion     
Chemical Attacks on Plastics
Corrosion Control Through Proper Design Techniques
Migration and Electromigration
DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE
Design Parameters
Operational Characteristics
Reference Documents
Electrical Design Specifications
Mechanical Design Specifications
Electrical and Thermal Parameters
Analysis
Thermal Analysis
Load Carrying and Vibration Analysis
Reliability and MTBF Calculations
First Year Electronic Failures
APPENDIX A: DESCRIPTION OF FINITE ELEMENT MODEL
APPENDIX B: STANDARD ATMOSPHERE
SI Unit
American (English) Unit
APPENDIX C: TRANSIENT FLOW EMPERICAL FACTOR
APPENDIX D: IMPACT OF CONVECTION ON SPREAD ANGLE
APPENDIX E: HEAT TRANSFER COEFFICIENTS MODEL: NARROW GAP VS. WIDE GAP
APPENDIX F: CREEP
Stages of Creep
Stress-Strain Relationship   
Impact of Creep in Electronics Packaging
APPENDIX G: FATIGUE
Mathematical Expressions for S-N Curves      
REFERENCES

Su questa edizione

• Editore: CRC Press
• Data di pubblicazione: 2008
• ISBN 10: 1420065319
• ISBN 13: 9781420065312
• Rilegatura: Copertina rigida
• Numero edizione: 2
• Numero di pagine: 320