Benefiting from Thermal and Mechanical Simulation in Micro-Electronics - Brossura

 
9781441948731: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
Brossura
ISBN 10: 1441948732 ISBN 13: 9781441948731
Casa editrice: Springer, 2010

Sinossi

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development.
Main areas covered are:-

  • The impact of simulation on industry profitability
  • Approaches to simulation
  • The state-of-the-art methodologies of simulation
  • Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.

    • Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

    Contenuti

    Preface. Simulation overview in the industry; B. Schwarz. Thermal & mechanical problems in microelectronics; O.F. Slattery, G. Kelly, J. Greer. Solder material characterization and modelling; S. Wiese, F. Feustel, E. Meusel. Polymer material characterisation and modelling; L.J. Ernst. Generic issues in numerical modeling; S. Pulko. Modeling of vapor pressure during reflow for electronic packages; X.J. Fan. Simulation for fatigue, cracks and delamination; R. Dudek, J. Auersperg, B. Michel. Experimental validation of finite element modeling; D. Vogel, C. Jian, I. De Wolf. Perspectives of non-linear simulation; M.A. Crisfield, A.J. Burton. Simulation-based optimisation in virtual thermo-mechanical prototyping of electronic packages; G.Q. Zhang, H.P. Stehouwer. Thermal fatigue reliability optimisation of Flip-Chip assemblies; B. Vandevelde, E. Beyne. Product and Process Optimization with simulation; D. den Hertog, P. Stehouwer.

    Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

    Editore
    Springer
    Data di pubblicazione
    2010
    Lingua
    Inglese
    ISBN 10 
    1441948732
    ISBN 13 
    9781441948731
    Rilegatura
    Copertina flessibile
    Numero di pagine
    208
    Redattore
    Zhang G.Q., Ernst L.J., De Saint Leger O.
    Contatto del produttore
    non disponibile
    Persona responsabile
    CMN Printpool Inh. Mathis Neumann
    https://www.also.com/ec/cms5/en_6000/6000/index.jsp

    Friedrich-Karl-Str. 9
    Hamburg
    Germania

    Altre edizioni note dello stesso titolo

    9780792372783: Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

    Edizione in evidenza

    ISBN 10:  0792372786 ISBN 13:  9780792372783
    Casa editrice: Springer-Verlag GmbH, 2000
    Rilegato