This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
· Provides a comprehensive overview of embedded memory design and associated challenges and choices;
· Explains tradeoffs and dependencies across different disciplines involved with multi-core and system on chip memory design;
· Includes detailed discussion of memory hierarchy and its impact on energy and performance;
· Uses real product examples to demonstrate embedded memory design flow from architecture, to circuit design, design for test and yield analysis.
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
Condizione: new. Questo è un articolo print on demand. Codice articolo cc3e0c7aeffb5e8a7f3bb86ff55114a5
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Da: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9781461488804_new
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory. 112 pp. Englisch. Codice articolo 9781461488804
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
Condizione: New. Codice articolo 20276530-n
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Da: GreatBookPrices, Columbia, MD, U.S.A.
Condizione: New. Codice articolo 20276530-n
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Da: moluna, Greven, Germania
Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive overview of embedded memory design and associated challenges and choicesExplains tradeoffs and dependencies across different disciplines involved with multi-core and system on chip memory designIncludes detailed dis. Codice articolo 4199821
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Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. xiii + 95. Codice articolo 2697854913
Quantità: 4 disponibili
Da: Majestic Books, Hounslow, Regno Unito
Condizione: New. Print on Demand pp. xiii + 95 63 Illus. (37 Col.). Codice articolo 94542366
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Da: Biblios, Frankfurt am main, HESSE, Germania
Condizione: New. PRINT ON DEMAND pp. xiii + 95. Codice articolo 1897854923
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Da: Revaluation Books, Exeter, Regno Unito
Hardcover. Condizione: Brand New. 2014 edition. 142 pages. 9.25x6.25x0.25 inches. In Stock. Codice articolo x-146148880X
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