This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.
· Provides a comprehensive overview of embedded memory design and associated challenges and choices;
· Explains tradeoffs and dependencies across different disciplines involved with multi-core and system on chip memory design;
· Includes detailed discussion of memory hierarchy and its impact on energy and performance;
· Uses real product examples to demonstrate embedded memory design flow from architecture, to circuit design, design for test and yield analysis.
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory. 112 pp. Englisch. Codice articolo 9781461488804
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Da: GreatBookPrices, Columbia, MD, U.S.A.
Condizione: New. Codice articolo 20276530-n
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
Condizione: New. Codice articolo 20276530-n
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Da: moluna, Greven, Germania
Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a comprehensive overview of embedded memory design and associated challenges and choicesExplains tradeoffs and dependencies across different disciplines involved with multi-core and system on chip memory designIncludes detailed dis. Codice articolo 4199821
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Da: Revaluation Books, Exeter, Regno Unito
Hardcover. Condizione: Brand New. 2014 edition. 142 pages. 9.25x6.25x0.25 inches. In Stock. Codice articolo x-146148880X
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
Buch. Condizione: Neu. Neuware -This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 112 pp. Englisch. Codice articolo 9781461488804
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Da: AHA-BUCH GmbH, Einbeck, Germania
Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes the various tradeoffs systems designers face when designing embedded memory. Readers designing multi-core systems and systems on chip will benefit from the discussion of different topics from memory architecture, array organization, circuit design techniques and design for test. The presentation enables a multi-disciplinary approach to chip design, which bridges the gap between the architecture level and circuit level, in order to address yield, reliability and power-related issues for embedded memory. Codice articolo 9781461488804
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Da: Buchpark, Trebbin, Germania
Condizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher. Codice articolo 24116585/12
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
Condizione: As New. Unread book in perfect condition. Codice articolo 20276530
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Da: Mispah books, Redhill, SURRE, Regno Unito
Hardcover. Condizione: Like New. Like New. book. Codice articolo ERICA773146148880X6
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