Microelectronics Packaging Handbook: Technology Drivers Part I - Brossura

Tummala, R.R.; Rymaszewski, Eugene J.; Klopfenstein, Alan G.

Brossura

ISBN 10: 1461540879 ISBN 13: 9781461540878

Casa editrice: Springer, 2012

Riassunto

Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.

Dettagli dell?edizione

• Editore: Springer
• Data di pubblicazione: 2012
• Lingua: Inglese
• ISBN 10: 1461540879
• ISBN 13: 9781461540878
• Rilegatura: Paperback
• Contatto del produttore: non disponibile
• Persona responsabile: non disponibile