Microelectronic Packaging: A Bibliography - Brossura

Agajanian, A. H.

 
9781468461077: Microelectronic Packaging: A Bibliography
Brossura
ISBN 10: 1468461079 ISBN 13: 9781468461077
Casa editrice: Springer, 2012

Sinossi

Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other parts of the system include electrical leads, heat removal paths, and mounting functions. At present, in order to meet the demands of VLSI, the emphasis is on packages with higher densities while maintaining performance, reliability, and low cost. This book is a comprehensive bibliography of over 3000 refer­ ences of the world literature in microelectronic packaging. It is compiled to assist the workers in the field in comparing their work with that done by others. For easy access to the needed references, the book is divided into many sections and subsections (see Contents). A comprehensive subject index is also given to assure easy access to the needed data. The book cites a number of books and review articles for the beginner in the field who wishes to become familiar with the subject. Novel technologies, such as bubble domain and multilayer ceramic packaging are highlighted. The literature from January 1976 to December 1978 is covered.

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Contenuti

I. Bibliographies.- II. Books.- III. Review Articles.- IV. Bonding Techniques.- 1. General.- 2. Adhesive.- 3. Beam-Lead.- 4. Chip Joining.- 5. Metal-Ceramic Seals.- 6. Metal-Glass Seals.- 7. Soldering.- 8. Thermocompression.- 9. Ultrasonic.- 10. Welding/Brazing.- 11. Others.- V. Interconnections.- 1. Single Layer.- 2. Multilayer.- VI. Metallized Ceramics.- VII. Encapsulation.- VIII. Hermeticity.- IX. Resistors.- X. Capacitors.- XI. Epdxies.- XII. Screens, Pastes, and Inks.- XIII. Coating/Passivation.- XIV. Plating.- XV. Electron Beam Techniques.- XVI. Laser Techniques.- 1. Resistor Trimming.- 2. Hole Drilling.- 3. Others.- XVII. Package Design.- 1. Computer-Aided Design (CAD).- 2. Others.- XVIII. Thermal Design.- 1. Cooling.- 2. Heat Sinks/Heat Pipes.- 3. Thermal Analysis.- XIX. Fabrication Techniques.- XX. Repair/Rework.- XXI. Types of Packages.- 1. Bubble Domain.- 2. Ceramic.- 3. Hybrid.- 4. Microwave.- 5. Multilayer Ceramic.- 6. Optoelectronic.- 7. Polyimide.- 8. Others.- XXII. Reliability.- 1. General.- 2. Bond Failure.- 3. Circuitry Failure.- 4. Encapsulation Failure.- 5. Contamination and Cleaning.- 6. Others.- XXIII. Testing.- 1. Accelerated Life Test.- 2. Boards/Cards.- 3. Bonds.- 4. Coatings.- 5. Integrated Circuits.- 6. Substrates.- 7. Others.- XXIV. Automation.- XXV. Equipment and Tooling.- XXVI. Cost and Yield.- XXVII. Future Trends.

Product Description

Book by Agajanian A H

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Editore
Springer
Data di pubblicazione
2012
Lingua
Inglese
ISBN 10 
1468461079
ISBN 13 
9781468461077
Rilegatura
Copertina flessibile
Numero di pagine
256
Contatto del produttore
non disponibile
Persona responsabile
CMN Printpool Inh. Mathis Neumann
https://www.also.com/ec/cms5/en_6000/6000/index.jsp

Friedrich-Karl-Str. 9
Hamburg
Germania

Altre edizioni note dello stesso titolo

9780306651830: Microelectronic Packaging: A Bibliography

Edizione in evidenza

ISBN 10:  0306651831 ISBN 13:  9780306651830
Casa editrice: Plenum Pub Corp, 1979
Rilegato