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Maximum Impact: Maxim's Quiet Rise as Silicon Valley's Most Prolific Analog Chip Maker - Rilegato

Doluca, Tunc

 
9781733858038: Maximum Impact: Maxim's Quiet Rise as Silicon Valley's Most Prolific Analog Chip Maker

Sinossi

In Maximum Impact, the author takes readers on an exciting journey, with its cast of exceptional founders, through the turbulent early days of Silicon Valley and the building of a remarkable analog tech company. Readers will enjoy this panoramic view, through the eyes of a bold, charismatic CEO and his genius comrades, as they participate in the creation of a technological revolution. This fascinating story about the growth of a semiconductor legend, provides compelling insights into a company culture that helped create the phenomenal success of Maxim Integrated. In this book, readers will also discover powerful business keys that contributed to the quiet rise of Silicon Valley’s most prolific analog chip maker. 

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Informazioni sugli autori

Tunç Doluca joined the Maxim Integrated team during the founding years and was part of the burgeoning semiconductor revolution in Silicon Valley. He has personally experienced Maxim's amazing story and closely worked with the company's first CEO, Jack Gifford, as both technical and executive leader. After Gifford handed the reins to him in 2007, Doluca began serving as the president and chief executive officer of Maxim. Over his career, he has designed more than 40 semiconductor products and registered 11 patents. Currently, Doluca serves on the boards of Maxim Integrated, the Semiconductor Industry Association (SIA), and Western Digital.

Kevin Paterson is a veteran journalist and writer/editor of about a dozen books. He enjoyed researching and documenting this great story of a legendary Silicon Valley tech company.

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Altre edizioni note dello stesso titolo

9781733858014: Maximum Impact: Maxim’s Quiet Rise as Silicon Valley’s Most Prolific Analog Chip Maker

Edizione in evidenza

ISBN 10:  1733858016 ISBN 13:  9781733858014
Casa editrice: Doluca Publishing, 2019
Brossura