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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture - Rilegato
Libro 88 di 203: Woodhead Publishing Series in Electronic and Optical Materials
Sinossi
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
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Informazioni sull'autore
Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. 482 pp. Englisch. Codice articolo 9781845695286
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
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Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Codice articolo 9781845695286
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