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Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module: Ceramic research and development in Japan - Rilegato
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This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
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Contenuti
Introduction. Introduction. Past and current studies. Modelling of fine powder mixing and measurement of the degree of mixing. Object of this study. Study of mixing models. Simulation of the flowpath in the doctor-blade and its application to raising the precision of green sheet thickness. Object of the study. Experimental procedure. Improving dimensional precision by firing in a reducing atmosphere. Purpose of the studies. Experimental methods. Effect of forming and firing conditions on the dimensions of ceramics. Object of the study. Experimental method. Improving the strength of tungsten metallization on alumina ceramics. Purpose of the studies. Experimental methods. Electrical insulation between fine metallization on alumina ceramics, and its protection. Purpose of the study. Experimental methods. Summary. Guidelines obtained by production process. Overall summary. References. Index.
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Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module Otsuka, K.
Da: Librairie Parrêsia, Figeac, Francia
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Hardcover Apr 30, 1993. Condizione: Used: Good. Multilayer Ceramic Substrate-Technology for Vlsi Package/Multichip Module | Otsuka | Elsevier, 1991. In-8° cartonné, 242 pages. Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage. Très bon état général pour cet ouvrage. [NM37]. Codice articolo 1219S0T2YA5
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent J. Codice articolo 4289215
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic research and development in Japan
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Condizione: New. In English. Codice articolo ria9781851665792_new
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | Ceramic research and development in Japan
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Buch. Condizione: Neu. Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module | Ceramic research and development in Japan | K. Otsuka | Buch | xiv | Englisch | 1993 | Springer Netherland | EAN 9781851665792 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand. Codice articolo 101952496
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
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Springer Netherlands, Springer Netherlands Apr 1993, 1993
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 260 pp. Englisch. Codice articolo 9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package
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Kluwer Academic Publishers Group, 1993
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Condizione: New. Presents a translation of an important Japanese work on electronic ceramics and includes much experimental data. This title is of interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of Japanese research in this field. Num Pages: 242 pages, biography. BIC Classification: TDCQ; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 254 x 178 x 16. Weight in Grams: 1200. . 1993. Hardback. . . . . Codice articolo V9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field. 260 pp. Englisch. Codice articolo 9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module : Ceramic research and development in Japan
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field. Codice articolo 9781851665792
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Multilayer Ceramic Substrate - Technology for VLSI Package
Editore:
Kluwer Academic Publishers Group, 1993
ISBN 10: 185166579X
ISBN 13: 9781851665792
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Da: Kennys Bookstore, Olney, MD, U.S.A.
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Condizione: New. Presents a translation of an important Japanese work on electronic ceramics and includes much experimental data. This title is of interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of Japanese research in this field. Num Pages: 242 pages, biography. BIC Classification: TDCQ; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 254 x 178 x 16. Weight in Grams: 1200. . 1993. Hardback. . . . . Books ship from the US and Ireland. Codice articolo V9781851665792
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