Packets with Deadlines: A Framework for Real-Time Wireless Networks - Brossura

Hou, I-Hong; Kumar, P.R.

Brossura

ISBN 10: 3031792564 ISBN 13: 9783031792564

Casa editrice: Springer, 2013

Riassunto

With the explosive increase in the number of mobile devices and applications, it is anticipated that wireless traffic will increase exponentially in the coming years. Moreover, future wireless networks all carry a wide variety of flows, such as video streaming, online gaming, and VoIP, which have various quality of service (QoS) requirements. Therefore, a new mechanism that can provide satisfactory performance to the complete variety of all kinds of flows, in a coherent and unified framework, is needed. In this book, we introduce a framework for real-time wireless networks. This consists of a model that jointly addresses several practical concerns for real-time wireless networks, including per-packet delay bounds, throughput requirements, and heterogeneity of wireless channels. We detail how this framework can be employed to address a wide range of problems, including admission control, packet scheduling, and utility maximization. Table of Contents: Preface / Introduction / A Study of the Base Case / Admission Control / Scheduling Policies / Utility Maximization without Rate Adaptation / Utility Maximization with Rate Adaptation / Systems with Both Real-Time Flows and Non-Real-Time Flows / Broadcasting and Network Coding / Bibliography / Authors' Biographies

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Informazioni sull?autore

I-Hong Hou received his B.S. in Electrical Engineering from National Taiwan University in 2004, and his M.S. and Ph.D. in Computer Science from University of Illinois, Urbana-Champaign in 2008 and 2011, respectively. In 2012, he joined the Department of Electrical and Computer Engineering at Texas A&M University, where he is currently an Assistant Professor. His research interests include wireless networks, wireless sensor networks, real-time systems, distributed systems, and vehicular ad hoc networks. Dr. Hou received the C.W. Gear Outstanding Graduate Student Award from the University of Illinois at Urbana-Champaign, and the Silver Prize in the Asian Pacific Mathematics Olympiad.P. R. Kumar obtained his B.Tech.degree in Electrical Engineering (Electronics) from I.I.T.Madras in 1973, and his M.S. and D.Sc. degrees in Systems Science and Mathematics from Washington University, St. Louis, in 1975 and 1977, respectively. From 1977-1984 he was a faculty member in the Department of Mathematics at the University of Maryland Baltimore County. From 1985-2011 he was a faculty member in the Department of Electrical and Computer Engineering and the Coordinated Science Laboratory at the University of Illinois. Currently, he is at Texas A&M University, where he holds the College of Engineering Chair in Computer Engineering. Kumar has worked on problems in game theory, adaptive control, stochastic systems, simulated annealing, neural networks, machine learning, queueing networks, manufacturing systems, scheduling, wafer fabrication plants, and information theory. His research is currently focused on power systems, wireless networks, and cyberphysical systems. Kumar is a member of the National Academy of Engineering of the USA, and the Academy of Sciences of the Developing World. He was awarded an honorary doctorate by ETH, Zurich. He received the IEEE Field Award for Control Systems, the Donald P. Eckman Award of the American Automatic Control Council, the Fred W. Ellersick Prize of the IEEE Communications Society,and the Outstanding Contribution Award of ACM SIGMOBILE.He is a Fellow of IEEE. He was a Guest Chair Professor and Leader of the Guest Chair Professor Group on Wireless Communication and Networking at Tsinghua University, Beijing, China. He is a D. J. Gandhi Distinguished Visiting Professor at IIT Bombay. He is an Honorary Professor at IIT Hyderabad. He was awarded the Distinguished Alumnus Award from IIT Madras, the Alumni Achievement Award from Washington University in St.Louis, and the Daniel C. Drucker Eminent Faculty Award from the College of Engineering at the University of Illinois.

Dettagli dell'edizione

• Editore: Springer
• Data di pubblicazione: 2013
• Lingua: Inglese
• ISBN 10: 3031792564
• ISBN 13: 9783031792564
• Rilegatura: Copertina flessibile
• Numero edizione: 1
• Numero di pagine: 120
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