High-Bandwidth Memory Interface - Brossura

Kim, Chulwoo; Lee, Hyun-Woo; Song, Junyoung

Brossura

ISBN 10: 3319023802 ISBN 13: 9783319023809

Casa editrice: Springer, 2013

Riassunto

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.

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Dalla quarta di copertina

<p>This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered. <br> <br>• Enables readers with minimal background in memory design to understand the basics of high-bandwidth memory interface design; <br>• Presents state-of-the-art techniques for memory interface design;<br>• Covers memory interface design at both the circuit level and system architecture level.<br></p>

Dettagli dell'edizione

• Editore: Springer
• Data di pubblicazione: 2013
• Lingua: Inglese
• ISBN 10: 3319023802
• ISBN 13: 9783319023809
• Rilegatura: Copertina flessibile
• Numero di pagine: 96
• Contatto del produttore: Springer Nature Customer Service Center GmbH; ProductSafety@springernature.com; ; Europaplatz 3; Heidelberg; 69115; Germania