The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer's view.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
EUR 10,30 per la spedizione da Regno Unito a Italia
Destinazione, tempi e costiDa: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9783658410421_new
Quantità: Più di 20 disponibili