The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.
Systems, vision and components in electronics assembly.- Manging automated electronics assembly.- PCB production equipment.- Modern platers and etchers.- Chemicals in PCB manufacturing.- Cleaning PCBs for higher quality.- Producing quality multilayer PCBs.- Plasma desmearing.- Chip-on-board technology.- Chip-and-wire technology.- TAB and flip-chip technology.- Component insertion equipment.- Workstations.- Automatic component insertion/placement systems.- Automated pin insertion.- Automated placement techniques.- Assembly challenges.- Robots in the electrical and electronics industry.- Consistency and quality using robots.- Robot hand exchangers.- Vision-guided assembly.- Vibratory insertion process: A new approach to non-standard component insertion.- SMT growth.- Realizing the benefits of SMT.- Designing reliability into surface-mount assemblies.- Design solutions.- Choosing SMT and setting up a facility.- SMT advantages.- Pick-and-place machines.- Surface-mount assembly using machine vision.- SMD placement using machine vision.- Hot-air leveling.- Testability circuit and board access problems.- Conductive epoxy for SMT solder replacement.- The removal and replacement of SMCs.- New applications.- New materials and equipment.- Integral substrate package technology.- Solder/cleaning, test and rework.- Solder joint acceptability.- Wave solder defects.- Soldering system trends.- Wave soldering: A study in process control.- Optimizing the wave soldering process.- Computerized soldering systems.- Re-examination of soldering techniques.- Adhesives for SMD wave soldering.- Adhesive evaluation.- Solder coating and leveling.- Screen printing.- Solvent flushing.- Rosin solder flux residues.- Aqueous cleaning.- Cleaning surface-mounted assemblies.- Desoldering components.- Bare-board testing.- Automatic optical inspection systems.- Machine vision.- Component testers and handlers.- Handlers.- Lead scanning.- Probe design and test fixturing.- Inspection equipment.- Image processing and non-destructive testing.- Design of SMA for testability.- Test and inspection of hybrid microcircuits.- In-circuit and functional ATE.- Functional test.- Test program development and processing power.- Robotic automated-test workcells.- Clean room technology.- Modular clean rooms.- Clean room air monitoring.- ESD control.- Static shielding techniques.- Computer control of modern factory operations.- Electronics CAE/CAD/CAM.- CAD/CAM for PCB manufacturing.- Designing PCBs for surface-mount assemblies.- CAD in hybrid production.- Discrete wired circuit board production.- Automating the assembly of electronic products.- Test, rework and inspection management costs.- Flexible manufacturing.- Computer simulation.- Local area networks.- Materials handling accessories.- Automated PCB handling.- Automated guided vehicle systems.- Batch-of-one assembly.- FMS for PCB assembly.- PCB assembly and test.- Factory control and robotic systems.- Authors’ organizations and addresses.
Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
Condizione: new. Questo è un articolo print on demand. Codice articolo QVROWBGEUX
Quantità: Più di 20 disponibili
Da: Ria Christie Collections, Uxbridge, Regno Unito
Condizione: New. In. Codice articolo ria9783662131633_new
Quantità: Più di 20 disponibili
Da: moluna, Greven, Germania
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in Assembly Engineering and Elect. Codice articolo 5222110
Quantità: Più di 20 disponibili
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. 628 pp. Englisch. Codice articolo 9783662131633
Quantità: 2 disponibili
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 628 pp. Englisch. Codice articolo 9783662131633
Quantità: 1 disponibili
Da: AHA-BUCH GmbH, Einbeck, Germania
Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in 'Assembly Engineering' and 'Electronic Packaging and Production', will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation. Codice articolo 9783662131633
Quantità: 1 disponibili
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 628. Codice articolo 26142291582
Quantità: 4 disponibili
Da: Majestic Books, Hounslow, Regno Unito
Condizione: New. Print on Demand pp. 628 39:B&W 8 x 10 in or 254 x 203mm Perfect Bound on White w/Gloss Lam. Codice articolo 135040417
Quantità: 4 disponibili
Da: Biblios, Frankfurt am main, HESSE, Germania
Condizione: New. PRINT ON DEMAND pp. 628. Codice articolo 18142291572
Quantità: 4 disponibili
Da: Revaluation Books, Exeter, Regno Unito
Paperback. Condizione: Brand New. reprint edition. 603 pages. 9.75x8.00x1.25 inches. In Stock. Codice articolo x-3662131633
Quantità: 2 disponibili