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Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
Print on DemandDa: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -In the dissertation 'Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for sub-THz Applications', a through-silicon via (TSV) technology module is developed targeting high frequency packaging applications in the millimeter-wave and sub-THz frequency range.Based on a high-performance 130 nm SiGe BiCMOS technology, TSVs are embedded in a via-middle integration approach. The TSV process module consists of the TSV integration, a carrier wafer handling and a wafer backside process to realize a redistribution layer. A process flow was developed to realize TSV structures with various geometries to ensure a high TSV design flexibility. The TSV process module can be applied for SiGe BiCMOS as well as for interposer technologies.High-performance TSV interconnections have been simulated to optimize their electrical properties. TSVs were electrically characterized and 3D transitions with low insertion loss <1 dB up to 300 GHz have been demonstrated thus providing excellent RF performance up to sub-THz frequencies.Different application areas like RF grounding, interposers with integrated waveguides as well as 300 GHz antennas are demonstrated. The potential of millimeter-wave packaging and 3D integration was evaluated.In this work, the use of TSVs for the millimeter wave and sub-THz frequency range was demonstrated. This opens up new possibilities for system integration and packaging of ultra-high frequency systems. 210 pp. Englisch. Codice articolo 9783961001965
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Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
Print on DemandDa: AHA-BUCH GmbH, Einbeck, Germania
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Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - In the dissertation 'Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for sub-THz Applications', a through-silicon via (TSV) technology module is developed targeting high frequency packaging applications in the millimeter-wave and sub-THz frequency range.Based on a high-performance 130 nm SiGe BiCMOS technology, TSVs are embedded in a via-middle integration approach. The TSV process module consists of the TSV integration, a carrier wafer handling and a wafer backside process to realize a redistribution layer. A process flow was developed to realize TSV structures with various geometries to ensure a high TSV design flexibility. The TSV process module can be applied for SiGe BiCMOS as well as for interposer technologies.High-performance TSV interconnections have been simulated to optimize their electrical properties. TSVs were electrically characterized and 3D transitions with low insertion loss <1 dB up to 300 GHz have been demonstrated thus providing excellent RF performance up to sub-THz frequencies.Different application areas like RF grounding, interposers with integrated waveguides as well as 300 GHz antennas are demonstrated. The potential of millimeter-wave packaging and 3D integration was evaluated.In this work, the use of TSVs for the millimeter wave and sub-THz frequency range was demonstrated. This opens up new possibilities for system integration and packaging of ultra-high frequency systems. Codice articolo 9783961001965
Quantità: 2 disponibili
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Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
Da: preigu, Osnabrück, Germania
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Taschenbuch. Condizione: Neu. Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications | Matthias Wietstruck | Taschenbuch | Englisch | Universitätsverlag Chemnitz | EAN 9783961001965 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. Codice articolo 128081874
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