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The semiconductor assembly process involves several steps, but the most important one is wire bonding. This step is considered the most delicate compared to other processes because it involves connecting the chip's bond pads to the package substrate. This book presents the optimization of the copper wire bonding (CWB) process, in which gold wire is replaced with copper wire, and the optimal process parameters are determined through reliability analysis, with the ultimate goal of improving product quality. Once the process study is complete and machine operation has been mastered, the next step is to define a design of experiments using specific software to identify the main factors influencing the copper wire bonding process. Finally, the bond pads are validated in accordance with quality requirements regarding reliability.
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Wire Bonding in Microelectronics
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Our Knowledge Publishing Okt 2026, 2026
ISBN 10: 6630598644
ISBN 13: 9786630598643
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware 60 pp. Englisch. Codice articolo 9786630598643
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Wire Bonding in Microelectronics : Reliability Analysis and Process Optimization
Editore:
Our Knowledge Publishing, 2026
ISBN 10: 6630598644
ISBN 13: 9786630598643
Nuovo
Taschenbuch
Da: AHA-BUCH GmbH, Einbeck, Germania
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Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The semiconductor assembly process involves several steps, but the most important one is wire bonding. This step is considered the most delicate compared to other processes because it involves connecting the chip's bond pads to the package substrate. This book presents the optimization of the copper wire bonding (CWB) process, in which gold wire is replaced with copper wire, and the optimal process parameters are determined through reliability analysis, with the ultimate goal of improving product quality. Once the process study is complete and machine operation has been mastered, the next step is to define a design of experiments using specific software to identify the main factors influencing the copper wire bonding process. Finally, the bond pads are validated in accordance with quality requirements regarding reliability. Codice articolo 9786630598643
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Wire Bonding in Microelectronics | Reliability Analysis and Process Optimization
Editore:
Our Knowledge Publishing, 2026
ISBN 10: 6630598644
ISBN 13: 9786630598643
Nuovo
Taschenbuch
Da: preigu, Osnabrück, Germania
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Taschenbuch. Condizione: Neu. Wire Bonding in Microelectronics | Reliability Analysis and Process Optimization | Ouadia Mouhat | Taschenbuch | Englisch | 2026 | Our Knowledge Publishing | EAN 9786630598643 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand. Codice articolo 138098738
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