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Through-Silicon Vias for 3D Integration(Chinese Edition)
Da: liu xing, Nanjing, JS, Cina
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paperback. Condizione: New. Paperback. Pub Date :2014-01-01 Pages: 487 Language: Chinese Publisher: Science Press Information Science and Technology Academic Works Series: silicon vias for 3D integration technology to discuss the three-dimensional integrated silicon systems used in electronics. optoelectronics and MEMS devices latest progress through hole (TSV) technology and the possible future evolution trend. while a three-dimensional integrated detailed discussion of the major technological problems that exist in ke. Codice articolo BX067803
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EUR 153,15
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Da: Cina a: U.S.A.
Quantità: 3 disponibili