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TMS320C55x DSP Application Design (3rd Edition) five universities planning materials(Chinese Edition)
Da: liu xing, Nanjing, JS, Cina
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paperback. Condizione: New. Paperback. Pub Date :2014-03-01 Pages: 403 Language: Chinese Publisher: Beijing University of Aeronautics and Astronautics Press TMS320C55x DSP Application Design (3rd Edition) five universities planning materials. TI's TMS320C55x series chips as an object. a systematic introduction to the basics of design methods developed DSP chip and DSP applications. The book is divided into 10 chapters. the main contents are: C55x hardware architecture and instruction; using assembly language. CC + + lan. Codice articolo BX067383
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