SEMICONDUCTOR LASER ENGINEERING AND INTEGRATED PHOTONICS: Laser Physics, Optical Waveguides, Modulators, Amplifiers, Photodetectors, PIC Design, and Optical Communication Systems - Brossura

A. K. Venkataraman, Rohan; S. M. Raghunathan, Kavitha

Brossura

ISBN 13: 9798160320618

Casa editrice: Independently published, 2026

Riassunto

Semiconductor Laser Engineering and Integrated Photonics provides a rigorous, engineering-focused treatment of semiconductor lasers, photonic integrated circuits, and optical communication systems, connecting fundamental device physics with modern PIC design and system-level performance.

Beginning with optical fields, photons, waveguide modes, semiconductor band structure, carrier statistics, absorption, spontaneous emission, stimulated emission, and optical gain, the book develops the physical foundations required to understand how semiconductor light sources operate. It then progresses through laser resonators, threshold conditions, diode-laser structures, steady-state performance, modulation dynamics, noise, chirp, and advanced laser architectures including DFB, DBR, VCSEL, tunable, quantum-dot, and mode-locked semiconductor lasers.

The integrated-photonics sections examine the devices and design principles used to build modern optical circuits. Topics include directional couplers, multimode-interference structures, Mach–Zehnder interferometers, ring resonators, arrayed-waveguide gratings, fiber-to-chip coupling, electro-optic phase shifters, Mach–Zehnder modulators, traveling-wave electrodes, thin-film lithium-niobate devices, ring modulators, electro-absorption modulators, photodetectors, TIAs, balanced receivers, semiconductor optical amplifiers, and nonlinear active-photonic effects.

The book also moves beyond isolated components to address the practical engineering of complete photonic platforms. Detailed coverage includes silicon photonics, silicon nitride, III–V platforms, heterogeneous material integration, foundry processes, PDK-based design, fabrication variation, yield engineering, packaging, fiber attachment, flip-chip integration, thermal management, reliability qualification, optical I/O, chiplets, and photonic–electronic co-design.

Communication-system chapters connect device performance to real link requirements through optical power budgets, chromatic dispersion, fiber nonlinearities, WDM, optical amplification, OSNR, PAM-4, coherent detection, QPSK, QAM, DSP, FEC, and launch-power optimization. Emerging system architectures are examined through programmable photonic circuits, co-packaged optics, integrated sensing, photonic computing, and scalable optical interconnects.

Key topics include:

• Semiconductor band structure, carrier statistics, and recombination
• Optical absorption, spontaneous emission, stimulated emission, and gain
• Laser resonators, longitudinal modes, threshold, efficiency, and thermal effects
• Direct modulation, relaxation oscillations, chirp, linewidth, and laser noise
• DFB, DBR, VCSEL, tunable, quantum-dot, and mode-locked lasers
• Optical waveguides, coupling, interferometers, resonators, and wavelength filters
• Silicon, III–V, SiN, and thin-film lithium-niobate photonics
• High-speed modulators and transmitter architectures
• PIN and avalanche photodetectors, balanced detection, and receiver front ends
• Semiconductor optical amplifiers and nonlinear photonic functions
• PIC fabrication, PDKs, process variation, yield, and foundry workflows
• Heterogeneous integration, packaging, thermal design, and reliability
• WDM, coherent communication, OSNR, DSP, FEC, and optical link engineering
• Optical I/O, co-packaged optics, chiplets, programmable photonics, and emerging architectures

Designed for upper-level undergraduate students, graduate students, researchers, photonics engineers, optoelectronic engineers, semiconductor-device engineers, and practicing professionals, this book provides a unified path from semiconductor physics to complete integrated optical systems.

Dettagli dell'edizione

• Editore: Independently published
• Data di pubblicazione: 2026
• Lingua: Inglese
• ISBN 13: 9798160320618
• Rilegatura: Copertina flessibile
• Numero di pagine: 519
• Contatto del produttore: non disponibile
• Persona responsabile: non disponibile