Ceramic Interconnect Technology Handbook

ISBN 10: 0849335574 / ISBN 13: 9780849335570

Editore: CRC Press, 2007

Like NewLIKE NEW. Codice articolo ERICA83808493355743

Riassunto:

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.

Informazioni sull?autore: III Barlow, Aicha Elshabini

Dati bibliografici

Titolo: Ceramic Interconnect Technology Handbook
Casa editrice: CRC Press
Data di pubblicazione: 2007
Legatura: Hardcover
Condizione: Like New
Tipologia articolo: book