Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

Noia, Brandon; Chakrabarty, Krishnendu

ISBN 10: 3319023772 / ISBN 13: 9783319023779

Editore: Springer, 2013

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Codice articolo I-9783319023779

Dati bibliografici

• Titolo: Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
• Editore: Springer
• Data di pubblicazione: 2013
• Lingua: Inglese
• ISBN 10: 3319023772
• ISBN 13: 9783319023779
• Rilegatura: Rilegato
• Condizione: New

Descrizione articolo

Riassunto

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

Informazioni sull?autore

Krishnendu Chakrabarty is a Professor of Electrical and Computer Engineering at Duke University. He received his PhD from University of Michigan. He is a Fellow of IEEE and a Distinguished Engineer of ACM.