Electronic Packaging and Interconnection Handbook

Harper, Charles A.

ISBN 10: 0071347453 / ISBN 13: 9780071347457

Editore: McGraw-Hill Professional, 2000

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Dati bibliografici

• Titolo: Electronic Packaging and Interconnection Handbook
• Editore: McGraw-Hill Professional
• Data di pubblicazione: 2000
• Lingua: Inglese
• ISBN 10: 0071347453
• ISBN 13: 9780071347457
• Rilegatura: Hardcover
• Edizione: terza edizione
• Condizione: Very Good

Descrizione articolo

Riassunto

Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook,Third Edition, continues to be the standard reference in its field. Here, in this single information-packed resource are all the data and guidelines you need for all types and levels of electronic packages, interconnection technologies, and electronic systems. No other book treats all of the subjects covered in this handbook in such an integrated and inter-related manner, a treatment designed to help you achieve a more reliable, more manufacturable, and more cost-effective electronic package. Here's everything you need to know about materials, thermal management, mechanical and thermomechanical stress behavior, wiring and cabling, soldering and solder technology, integrated circuit packaging, surface mount technologies, rigid and flexible printed wiring boards. And with over 60% new material, this third edition brings you thoroughly up to speed on a new generation of packaging technologies: single chip packaging...ball gridarrays...chip scale packaging...low-cost flip chiptechnologies...direct chip attach, and more.

Informazioni sull?autore

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.