Electronic Packaging, Microelectronics, and Interconnection Dictionary

Harper, Charles A., Miller, Martin B.

ISBN 10: 0070266883 / ISBN 13: 9780070266889

Editore: McGraw-Hill, 1993

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Item in very good condition! Textbooks may not include supplemental items i.e. CDs, access codes etc.

Codice articolo 00085119714

Dati bibliografici

• Titolo: Electronic Packaging, Microelectronics, and Interconnection Dictionary
• Editore: McGraw-Hill
• Data di pubblicazione: 1993
• Lingua: Inglese
• ISBN 10: 0070266883
• ISBN 13: 9780070266889
• Rilegatura: Rilegato
• Condizione: Very Good

Descrizione articolo

Riassunto

Today's rapidly evolving world of electronic packaging and interconnection is critical to the success of modern high-performance electronic systems, yet the increasingly multidisciplinary nature of the field has created a language barrier that often impedes progress.
This one-of-a-kind dictionary helps professionals and students understand and correctly use the terminology of both their own specialty and other disciplines relevant to electronic packaging, microelectronics, and interconnection. It presents up-to-date entries and clear, concise definitions for more than 6,000 terms and abbreviations, as well as extensive section covering acronyms and symbols.
No matter what your specialty, you can get the working knowledge you need to effectively interface with other disciplines and boost your performance; better understand the electrical, mechanical, and material requirements for products which must be manufactured; and quickly gain knowledge that is absolutely critical for success on the job.
From circuits and communications systems to all types of electronic subsystems and assemblies, this essential desk reference bridges the gap between electrical, mechanical, and materials engineering!

Informazioni sull?autore

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.