Electrothermal Analysis of VLSI Systems

Yi-Kan Cheng; Ching-Han Tsai; Chin-Chi Teng; Sung-Mo (Steve) Kang

ISBN 10: 079237861X / ISBN 13: 9780792378617

Editore: Springer, 2000

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Dati bibliografici

• Titolo: Electrothermal Analysis of VLSI Systems
• Editore: Springer
• Data di pubblicazione: 2000
• Lingua: Inglese
• ISBN 10: 079237861X
• ISBN 13: 9780792378617
• Rilegatura: Rilegato
• Condizione: New

Descrizione articolo

Riassunto

This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.

Recensione

From the Foreword:

`Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This text provides a comprehensive formulation of the electrothermal analysis problem beginning with a summary of the sources of power dissipation in CMOS circuits and followed by a formulation of the effect of temperature on MOS devices.'
Dr. Ralph K. Cavin, Vice President, Semiconductor Research Corporation