Failure Analysis of Integrated Circuits

Lawrence C. Wagner

ISBN 10: 1461372313 / ISBN 13: 9781461372318

Editore: Springer US, Springer New York Nov 2012, 2012

Riguardo questo articolo

Neuware -Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 272 pp. Englisch.

Codice articolo 9781461372318

Dati bibliografici

• Titolo: Failure Analysis of Integrated Circuits
• Editore: Springer US, Springer New York Nov 2012
• Data di pubblicazione: 2012
• Lingua: Inglese
• ISBN 10: 1461372313
• ISBN 13: 9781461372318
• Rilegatura: Taschenbuch
• Condizione: Neu
• Dimensioni: 235 L x 155 A x 15 P (millimetri) 235 millimetri di larghezza per 155 millimetri di altezza per 15 millimetri di profondità
• Peso: 417 grammi

Descrizione articolo

Riassunto

Failure Analysis of Integrated Circuits: Tools and Techniques provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits. These include applications specific to performing failure analysis such as decapsulation, deprocessing, and fail site isolation, as well as physical and chemical analysis tools and techniques. The coverage is qualitative, and it provides a general understanding for making intelligent tool choices. Also included is coverage of the shortcomings, limitations, and strengths of each technique.
Failure Analysis of Integrated Circuits: Tools and Techniques is a `must have' reference work for semiconductor professionals and researchers.

Contenuti

Preface. 1. Introduction; L.C. Wagner. 2. Electrical Characterization; S. Frank, et al. 3. Package Analysis: SAM and X-Ray; T.M. Moore, C. Hartfield. 4. Die Exposure; P.D. Ngo. 5. Global Failure Site Isolation: Thermal Techniques; D.L. Barton. 6. Failure Site Isolation: Photon Emission Microscopy Optical/Electron Beam Techniques; E.I. Cole, D.L. Barton. 7. Probing Technology for IC Diagnosis; C.G. Talbot. 8. Deprocessing; D. Yim. 9. Cross-Section Analysis; T. Haddock, S. Boddicker. 10. Inspection Techniques; L.C. Wagner. 11. Chemical Analysis; L.C. Wagner. 12. Energy Dispersive Spectroscopy; P.D. Ngo. 13. Auger Electron Spectroscopy; R.K. Lowry. 14. Secondary Ion Mass Spectrometry, SIMS; K. Evans. 15. Failure Analysis Future Requirements; D.P. Vallett. Index.