Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)

[ MEI ] BEI SI&amp#183; KAI SE ( Beth Keser ) . [ DE ] SI DI FEN&amp#183; KE LUO NA TE

ISBN 10: 7111755804 / ISBN 13: 9787111755807

Editore: Mechanical Industry Press, 2024

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Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.

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• Titolo: Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
• Editore: Mechanical Industry Press
• Data di pubblicazione: 2024
• Lingua: Inglese
• ISBN 10: 7111755804
• ISBN 13: 9787111755807
• Rilegatura: paperback
• Condizione: New