Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)

Schwizer, J?rg; Mayer, Michael; Brand, Oliver

ISBN 10: 3540221875 / ISBN 13: 9783540221876

Editore: Springer, 2004

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We are unable to ship to Canada at this time.Ex-Library hardcover in very nice condition with all the usual markings and attachments. Text block clean and unmarked. Tight binding.

Codice articolo UTL53618

Dati bibliografici

• Titolo: Force Sensors for Microelectronic Packaging Applications (Microtechnology and MEMS)
• Editore: Springer
• Data di pubblicazione: 2004
• Lingua: Inglese
• ISBN 10: 3540221875
• ISBN 13: 9783540221876
• Rilegatura: Hardcover
• Condizione: Very Good
• Peso: 15 once

Descrizione articolo

Riassunto

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Dalla quarta di copertina

This monograph is intended for wire bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors. New measurement technologies are introduced that allow in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here enables measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.