Handbook of 3D Integration Vol

ISBN 10: 3527332650 / ISBN 13: 9783527332656

Editore: Vch Pub, 2012

Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc. Codice articolo 00099713301

Riassunto:

Beiträge von Forschern und Strategen an Universitäten und aus der Industrie diskutieren hier die physikalischen Grenzen der klassischen 2D-Elektronik und beleuchten die Erfordernisse des Marktes sowie Ansatzpunkte für zukünftige Entwicklungen.

Informazioni sull?autore: Dr. Philip Garrou, from Microelectronic Consultants of North Carolina, specializes in thin film microelectronic materials and applications, prior to which he was Director of Technology and New Business Development for Dow Chemicals - Advanced Electronic Materials business. He
is a fellow of IEEE and IMAPS, has served as Associate Editor of the IEEE Transactions on Advanced Packaging, has authored two microelectronics texts and is co-author of over 75 peer reviewed publications and book chapters.

Dr. Christopher Bower is currently a Technical Manager at Semprius Inc., Durham, NC, where he leads a group working on the assembly and wafer-level packaging of advanced multi-junction solar cells for concentrator photovoltaics (CPV). Previously he was a senior scientist at RTI International where he worked on multiple DARPA-funded 3D integration programs. Dr. Bower has authored or co-authored over fifty papers and holds four patents.

Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Dr. Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for over two decades on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He received
the 'Ashman Award 2009' from the International Electronics Packaging Society (IMAPS) 'For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies'. Peter Ramm is Fellow and Life Member of IMAPS, organizing committee
and founding member of IEEE 3DIC conference and co-editor of Wiley's 'Handbook of Wafer Bonding'.

Dati bibliografici

Titolo: Handbook of 3D Integration Vol
Casa editrice: Vch Pub
Data di pubblicazione: 2012
Legatura: Brossura
Condizione: Good