Introduction to Microelectronic Fabrication (2nd Edn) (Modular Series on Solid State Devices) (Volume 5)

Jaeger, Richard

ISBN 10: 0201444941 / ISBN 13: 9780201444940

Editore: Prentice Hall, 2002

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Volume 5. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. Book contains pencil markings. In poor condition, suitable as a reading copy. Library sticker on front cover. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,650grams, ISBN:9780201444940.

Codice articolo 4326120

Dati bibliografici

• Titolo: Introduction to Microelectronic Fabrication (2nd Edn) (Modular Series on Solid State Devices) (Volume 5)
• Editore: Prentice Hall
• Data di pubblicazione: 2002
• Lingua: Inglese
• ISBN 10: 0201444941
• ISBN 13: 9780201444940
• Rilegatura: Brossura
• Edizione: seconda edizione
• Condizione: Poor
• Peso: 650 grammi
• Cataloghi dei venditori:
  • Engineering

Descrizione articolo

Riassunto

For courses in Theory and Fabrication of Integrated Circuits.

The author's goal in writing this text was to present a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing, and is highlighted by careful explanations, clear, simple language, and numerous fully-solved example problems. This work assumes a minimal knowledge of integrated circuits and of terminal behavior of electronic components such as resistors, diodes, and MOS and bipolar transistors.

Dalla quarta di copertina

Introduction to Microelectronic Fabrication, Second Edition, by Richard C. Jaeger, is a concise survey of the most up-to-date techniques in the field. It is devoted exclusively to processing and is highlighted by careful explanations, clean, simple language, and numerous fully solved example problems.

The second edition includes an entirely new chapter on MEMS, as well as substantial modifications to the chapters on MOS and bipolar process integration. Also included is new or expanded coverage of lithography and exposure systems, trench isolation, chemical mechanical polishing, shallow junctions, transient enhanced diffusion, copper Damascene processes and process simulation.