Materials for Information Technology : Devices, Interconnects and Packaging

Lingua: inglese

Editore: Springer London Sep 2005, 2005

1852339411 / 9781852339418

Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

Venditore con 5 stelle

Venditore AbeBooks dal 14 agosto 2006

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Descrizione dell’articolo da parte del venditore

Neuware - The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of materials used for information technology with a focus on future applications. Included are:materials for silicon-based semiconductor devices (including high-k gate dielectric materials); materials for nonvolatile memories; materials for on-chip interconnects and interlayer dielectrics (including silicides, barrier materials, low-k and ultra low-k dielectric materials); and materials for assembly and packaging The latest results in materials science and engineering as well as applications in the semiconductor industry are covered including the synthesis of blanket and patterned thin film materials, their properties, constitution, structure and microstructure. Computer modelling and analytical techniques to characterise thin film structures are also included to give a comprehensive survey of materials for the IT industry.The Engineering Materials and Processes series focuses on all forms of materials and the processes used to synthesise and formulate them as they relate to the various engineering disciplines. The series deals with a diverse range of materials: ceramics; metals (ferrous and non-ferrous); semiconductors; composites, polymers, biomimetics etc. Each monograph in the series is written by a specialist and demonstrates how enhancements in materials and the processes associated with them can improve performance in the field of engineering in which they are used.

Codice articolo 9781852339418

Titolo
Materials for Information Technology : Devices, Interconnects and Packaging
Autore
Caroline Whelan
Editore
Springer London Sep 2005
Anno di pubblicazione
2005
Condizione
Neu
Rilegatura
Buch
Lingua
inglese
ISBN 10
1852339411
ISBN 13
9781852339418
Peso dell'articolo
947 grammi
Dimensioni
243x162x34 mm

AHA-BUCH GmbH

Einbeck, Germania

Venditore con 5 stelle

Venditore AbeBooks dal 14 agosto 2006

Tariffe di spedizione da Germania a U.S.A.

ArticoloDa 5 a 7 giorni lavorativiDa 7 a 10 giorni lavorativi
Primo articoloEUR 30,50EUR 30,50
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