Micro System Technologies 90 : 1st International Conference on Micro Electro, Opto, Mechanic Systems and Components Berlin, 10-13 September 1990

On September 10-13, 1990, the first international meeting on Microsystem Technologies takes place at the Berlin International Congress Center. Most of the traditional congresses deal with themes that become more and more specific, and only a small part of the scientific world is reflected. The Micro System Technologies is attempting to take the opposite direction: During the last two decades the development of microelectronics was characterized by a tremendous increase of complexity of integrated circuits. At the same time the fields of microoptics and micromechanics have been developed to an advanced state of the art by the application of thin film and semiconductor technologies. The trend of the future development is to increase the integration density by combining the microelectronic, microoptic, and micro mechanic aspects to new complex multifunctional systems, which are able to comprise sensors, actuators, analogue and digital circuits on the same chip or on multichip-modules. Microsystems will lead to extensions of the field of microelectronic applications with important technical alterations and can open new considerable markets. For the realization of economical solutions for microsystems a lot of interdisciplinary cooperation and know-how has to be developed. New materials for sensitive layers, substrates, conducting, semiconducting, or isolating thin films are the basis for the development of new technologies. The increasing complexity leads to increasing interaction among electrical and non-electrical quantities.

Simulation and Design.- Design of Micro Systems.- Microsystems: a challenge for CAD development (Plenary Talk).- A specification driven environment for microsystem design (Invited Paper).- Conceptual design of micro-electro-mechanical systems.- Intelligent CAD for micro mechanics.- CAD of Optical Devices.- Computer aided engineering for microsystems — status and trends (Plenary Talk).- Numerical simulation of optical devices.- CAD-tool for integrated optic coupling gratings.- Simulation on lateral detector — optical waveguide coupling.- Simulation and Design — Electrical and Thermal Properties.- Electrical connections through silicon wafer: application to 3D-multichip modules (Invited Paper).- Design methods for multichip systems (Invited Paper).- A fully-automatic macromodeling procedure for the electrical Simulation of integrated circuits.- KOSIM — a multi-level simulator for the design of integrated circuits.- Waveform estimation and hazard detection in digital MOS circuits.- Modelling of interconnects by boundary element method.- Thermal analysis of integrated circuits.- Sensitivity analysis in thermal wave measurement.- Simulation and Design of Sensors.- Design and simulation of sensors (Invited Paper).- Finite-element simulation of silicon accelerometers.- Accelerometer design considerations.- Measurement and Testing.- Testing.- Development of a thermal test chip.- Infrared microscopy — contactless temperature measurement on miniaturized electronic components.- Highly sensitive strain sensor for the qualification of epoxy compounds designed for the encapsulation of microsystems.- Material Characterization — Physical Properties.- Mechanical reliability of electronic devices.- Measurement of internal stress in thin silicon membranes.- Measurement of the thermal diffusivity of electrically nonconducting substrates.- Characterization of supersmooth surfaces with roughness below 0.1 nm.- Material Characterization — Semiconductor Characteristics.- Non-destructive testing of semiconductor materials using microwave photoconductivity.- Electrical characterization of III/V materials for heterostructure devices.- Material Characterization — Optical Methods.- Assessment of III–V epitaxial layers by optical methods.- Ellipsometry for process control in reaktive ion etching.- Thin film ellipsometric measurements — a tool for research and production.- High precision non-contacting metrology based on short coherence interferometry.- VIS-IR-ellipsometry for control and characterization of thin film processes.- Materials.- Materials for Packaging and Passivation.- Deposition, patterning, properties, and applications of AI2O3 films.- PECVD-passivation layers for printheads in micro-system-technology.- Hybrid integrated circuits on polycrystalline aluminium nitride.- High performance resin system for printed circuit boards.- Z-axis conductive, stress free, thermally conductive adhesive films and pastes for die- and component attach.- Integrated Optics Materials and Technologies.- Integrated optics in silicon.- Integrated optics on silicon with PECVD-fabricated waveguides.- Polymer waveguides in integrated optics.- Technologies.- Pattern Generation and Image Transfer.- Aspects of patterning inorganic-organic copolymers (ORMOCERs).- Photopattemable layers from amorphous, diamond-like carbon — an innovative material for microsystems technology.- Submicrometer photolithography by surface imaging — experiments and simulation.- X-ray imaging system.- Laser Supported Deposition.- Laser induced gold deposition on polyimide layers.- Selective pattern deposition of SnO2 thin film by laser pyrolysis.- Plane surface embedding technique for thin film hybrids.- Pulsed laser-plasma deposition of polycomponent thin-film structures — a review.- Laser-induced chemical vapour deposition of thin films in microelectronics.- Reactive Etching and Deposition.- Plasma-assisted etching (Invited Paper).- Reactive etching with ECR plasma source.- Production of resist masks by means of RIE.- Contact Methods.- A new explanation for the degradation of gold-aluminium bonds.- Simulation of the inner lead bonding process.- The application of an eutectic Gold-Tin cushion for TAB-inner lead bonding with reduced bonding pressure.- Bonding techniques on microsystem in cryogenics and microelectronic engineering.- Laser soldering of TAB inner lead bonds.- Packaging.- Solderable bumps for TAB and flip-chip bonding (Invited Paper).- Electroless bumping.- Hybridization of cooled mosaic sensors by indium-bumps.- Development of a fine pitch bumping process.- Tape automated bonding for high-density electronic packaging.- Adhesiveless copper-polyimide laminates for TAB’s.- Optical Assembly and Interconnection Technologies.- Application of micromachining and micromechanics to components for optical communication (Invited Paper).- Thermal tunable minimized semiconductor laser-module.- Micro collimated light source using micro fresnel lens.- Monomode fused optical system elements.- Sensor and Actuator Technologies.- Sensor packaging (Invited Paper).- A method for thermal insulation of microstructures.- Machining of metal foils for use in microcompact heat exchangers.- Novel stress free assembly technique for micromechanical devices.- The LIGA process for microsystems (Invited Paper).- Movable microstructures manufactured by the LIGA process as basic elements for microsystems.- Ion beam techniques for micro electro mechanical systems (Invited Paper).- A novel mask compensation pattern for etched microstructures with several convex corners.- Wafer bonding and etchback techniques for silicon-on-insulator systems.- Basic Components and Applications.- Sensors for Physical Parameters.- Silicon microsystems as an industry (Invited Paper).- Micromachined silicon devices integrated with standard IC processes.- Design of an integrated humidity sensor with digital output in double metal CMOS technology.- CMOS compatible capacitive pressure sensor with read-out electronics.- Piezoresistive pressure sensors representing the 2nd generation avoid the physical limits based on conventional designs.- High performance miniaturized piezoresistive pressure transducers.- Fully integrated silicon pressure sensor with on-chip CMOS evaluation circuit and on-chip trimming.- Optimization of bipolar magneto-transistors.- Silicon RF power sensor from DC to microwave.- Self-testable accelerometer microsystem.- Micromechanical capacitive acceleration sensor with force compensation.- Capacitive accelerometer made by silicon micromechanics.- Micromechanical acceleration sensor.- CMOS readout electronics for capacitive acceleration sensors.- Gas and Ionic Sensors.- Development of basic structures for integrated chemical sensors for SO2 and NH3.- Technology and application of suspended gate field effect transistors for gas detection.- Preparation of TiO2 films for oxygen sensors.- Solid state chemical sensors in thick film technique.- Ionic sensor layers on microelectronic structures for the detection of solvent vapours.- An integrated ISFET-sensorarray with a CMOS signal-processing circuit.- CVD-Al2O3-layers: applicability in sensor devices.- Sensors for Biological and Medical Application.- Biochemical sensors for microsystems (Plenary Talk).- Miniaturised thin-film biosensors (Invited Paper).- Chip-biosensors — integration of bioactive components with transducers made in silicon technology.- Smart silicon system for a multi sensor catheter.- A digital output monolithic temperature sensor for invasive applications.- Optical Sensors.- New nanomechanical integrated optical devices as modulators, switches, and microphones; integrated optical (bio-)chemical sensors (Invited Paper).- High resolution interferometric displacement sensor using integrated optics in glass.- Integrated optical devices in LiNbO3 for sensors.- Optical Components.- Optoelectronic components and modules for multigigabit/s fibre optic transmission.- Elements for integrated optics coherent receiver networks.- Wavelength division multiplexers for optical communication systems.- Pin photodiodes and field-effect transistors for monolithically integrated InP/lnGaAs optoelectronic circuits.- Semiconductor laser amplifiers as multifunctional devices.- Fiber optical amplifiers: technology and system applications.- Integrated optic Polarimetric refractometer.- Actuators.- Integrated fluid control systems on a silicon wafer (Invited Paper).- Micro liquid-handling devices — a review.- Electrically-activated, micromachined diaphragm valves.- An electrohydrodynamic injection pump — a novel actuator for microsystem technology.- Electrostatic and superconducting microactuators (Invited Paper).- Levitational bearing systems by meissner effect.- Rotational behaviour of living cells with reference to micro-motors.- Magnetically driven microactuators: design considerations.- Development of micro grippers.- Micro-actuator for micro-particles.- Author Index.