Microelectronics Packaging Handbook, Vols. 1-3

Alan G. Klopfenstein Eugene J. Rymaszewski Rao Tummala R.R. Tummala

ISBN 10: 0412085615 / ISBN 13: 9780412085611

Editore: Springer, 1998

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pp. 1000 2nd Edition.

Codice articolo 26296973

Dati bibliografici

• Titolo: Microelectronics Packaging Handbook, Vols. 1-3
• Editore: Springer
• Data di pubblicazione: 1998
• Lingua: Inglese
• ISBN 10: 0412085615
• ISBN 13: 9780412085611
• Edizione: seconda edizione
• Condizione: New

Descrizione articolo

Riassunto

The Microelectronics Packaging Handbook continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing processes. Now available on CD-ROM for the first time, it discusses state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. The CD-ROM version includes a navigational scheme for easy access to content, hypertext links for glossary terms, references, footnotes and graphics, and full text search capabilities for more powerful querying of the information.

Contenuti

Volume I: Microelectronics packaging design overview. Package wiring and terminals. Package electrical design. Heat transfer in electronic packages. Package reliability. package manufacture and assembly.
Volume II: Microelectronics first-level package overview. Chip-to-package interconnection. Plastic packaging. Ceramic packaging. Polymers in packaging. Thin-film packaging. First level package electrical testing. Package sealing and encapsulation.
Volume III: Microelectronics second-level and higher package overview. Package-to-board interconnections. Printed-circuit board packaging. Wiring. Coated-metal packaging. Connector and cable packaging. Optical packaging