Modeling and Application of Flexible Electronics Packaging. Questo articolo non è disponibile.
Lingua: inglese
Editore: Springer, 2019
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Descrizione dell’articolo da parte del venditore
Modeling and Application of Flexible Electronics Packaging | Yongan Huang (u. a.) | Buch | xvii | Englisch | 2019 | Springer | EAN 9789811336263 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Codice articolo 114895019
- Titolo
- Modeling and Application of Flexible Electronics Packaging
- Autore
- Yongan Huang (u. a.)
- Editore
- Springer
- Anno di pubblicazione
- 2019
- Condizione
- Neu
- Rilegatura
- Buch
- Lingua
- inglese
- ISBN 10
- 9811336261
- ISBN 13
- 9789811336263
- Peso dell'articolo
- 629 grammi
- Dimensioni
- 241 x 160 x 23 mm
- Cataloghi dei venditori
- Bücher
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
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Informazioni sull’autore
Zhouping Yin received the B.S. and Ph.D. degrees in mechanical engineering from Huazhong University of Science and Technology (HUST), Wuhan, China, in 1994 and 2000, respectively. He is a Distinguished Professor and has been the Vice Head of the State Key Laboratory of Digital Manufacturing Equipment and Technology, HUST, since 2005. He is a Principal Investigator for projects sponsored by the General Program and Major Program of the National Science Foundation and the National Basic Research Project of China. He is leading a research group and conducting research in the electronic manufacturing equipment and technology, including printed electronics and radio frequency identification packaging. Dr. Yin was appointed as the Changjiang Distinguished Professor from Ministry of Education of China in 2009. He received the National Science Fund for Distinguished Young Scholars of China.
Xiaodong Wan received his B.S. and Ph.D. degrees in engineering mechanics from Huazhong University of Science and Technology (HUST), Wuhan, China, in 2012 and 2016, respectively. He is currently a Postdoctoral Fellow at the School of Mechanical Science and Engineering, HUST. His research interests include flexible electronics manufacturing and laser processing. Dr. Wan received the Young Scientists Fund of the National Natural Science Foundation of China.
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