Moisture Sensitivity of Plastic Packages of IC Devices (Micro and Opto-electronic Materials, Structures, and Systems)

Fan, X.J. (Editor) / Suhir, E. (Editor)

ISBN 10: 1461426251 / ISBN 13: 9781461426257

Editore: Springer-Verlag New York Inc., 2012

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572 pages. 9.20x6.10x1.33 inches. In Stock.

Codice articolo x-1461426251

Dati bibliografici

• Titolo: Moisture Sensitivity of Plastic Packages of IC Devices (Micro and Opto-electronic Materials, Structures, and Systems)
• Editore: Springer-Verlag New York Inc.
• Data di pubblicazione: 2012
• Lingua: Inglese
• ISBN 10: 1461426251
• ISBN 13: 9781461426257
• Rilegatura: Paperback
• Condizione: Brand New
• Peso: 0,88 chilogrammi

Descrizione articolo

Riassunto

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Dalla quarta di copertina

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: Thorough exploration of moistures effects based on lectures and tutorials by the authors Consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging Emerging theories and cutting-edge industrial applications presented by the leading professionals in the fieldMoisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.