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Unread book in perfect condition. Codice articolo 20301174
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
Informazioni sull'autore: Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
Titolo: Packaging of High Power Semiconductor Lasers
Casa editrice: Springer
Data di pubblicazione: 2014
Legatura: Rilegato
Condizione: As New