Da
HPB-Red, Dallas, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Venditore AbeBooks dal 11 marzo 2019
Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Codice articolo S_418959562
Anyone involved in the field of chemical engineering or responsible for process design, maintenance, and analysis will appreciate Process Engineering Analysis in Semiconductor Device Fabrication - the only current book that offers comprehensive coverage of the growing interest in process improvement. Now, more than ever, it is evident that process improvement will enhance attempts to improve economic efficiency in the semiconductor device industries.
Much of the book includes recent material presented with a degree of integration and criticism not available in the original journal publications. Worked examples illustrate how one uses fundamental principles to model processes. Where possible, models are compared with experimental data, and the success and/or failure of a model is presented as a learning experience. In addition, an extensive set of problems offers an opportunity for the reader to be guided into directions beyond the scope of the book itself.
The two authors' vast combined experience in the fields of chemical engineering, process engineering, electrical engineering, and physics offers readers expert insight into as well as broad exposure to new areas of technology.
Product Description: Book by Middleman Stanley Hochberg Arthur
Titolo: Process Engineering: Analysis in ...
Casa editrice: McGraw-Hill College
Data di pubblicazione: 1993
Legatura: Hardcover
Condizione: Good
Da: Bookbot, Prague, Repubblica Ceca
Hardcover. Condizione: Fair. Spuren von Feuchtigkeit / Nässe; Aus Bibliothek aussortiert; Leichte Abnutzungen; Farbveränderung durch Alter/Sonne. Codice articolo f1870316-5f76-4901-9991-0af11437e466
Quantità: 1 disponibili
Da: Orion Tech, Kingwood, TX, U.S.A.
Hardcover. Condizione: Good. Codice articolo 0070418535-3-34832217
Quantità: 1 disponibili
Da: Jenson Books Inc, Logan, UT, U.S.A.
hardcover. Condizione: Good. The item is in good condition and works perfectly, however it is showing some signs of previous ownership which could include: small tears, scuffing, notes, highlighting, gift inscriptions, and library markings. Codice articolo 4BQGBJ0150OA
Quantità: 1 disponibili
Da: Alien Bindings, BALTIMORE, MD, U.S.A.
Hardcover. Condizione: Very Good. No Jacket. First Edition. Very Good condition overall. The covers show a little shelf wear. A small section of the outer coating near the bottom of the spine has peeled off. The binding is tight. Former owner's name is marked out on the front edge of the text block. The interior pages are clean and unmarked. USPS electronic tracking number issued free of charge. Codice articolo 11364
Quantità: 1 disponibili
Da: Better World Books, Mishawaka, IN, U.S.A.
Condizione: Good. Used book that is in clean, average condition without any missing pages. Codice articolo 4710206-6
Quantità: 1 disponibili
Da: Buchpark, Trebbin, Germania
Condizione: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher. Codice articolo 42647803/203
Quantità: 2 disponibili
Da: The Book Spot, Sioux Falls, MN, U.S.A.
Hardcover. Condizione: New. Codice articolo Abebooks16487
Quantità: 1 disponibili
Da: Toscana Books, AUSTIN, TX, U.S.A.
Hardcover. Condizione: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks. Codice articolo Scanned0070418535
Quantità: 1 disponibili
Da: DeckleEdge LLC, Albuquerque, NM, U.S.A.
Condizione: New. Codice articolo Shelfdream0070418535
Quantità: 1 disponibili