Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits

Lingua: inglese

Editore: Springer US Okt 2012, 2012

1461359422 / 9781461359425

Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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Venditore AbeBooks dal 11 gennaio 2012

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This item is printed on demand - it takes 3-4 days longer - Neuware -The goal ofputting 'systems on a chip' has been a difficultchallenge that is only recently beginning to be met. Since the world is 'analog'putting systems on achip requires putting analog interfaces on the samechip as digital processing functions. Since some processing functions are accomplished more efficiently in analog cir cuitry, chips with a large amountofanalog and digital circuitry are beingdesigned. Whethera small amountor analog circuitryiscombined with varying amounts ofdig ital circuitry or the other way around, theproblems encountered in marrying analog and digital circuitryarethe samebutwith differentscope. Someofthe mostprevalent problems are chip/packagecapacitiveand inductivecoupling, ringing on the RLC tuned circuits thatfonn the chip/package powersupply rails and off-chip drivers and receivers, coupling betweencircuits through thechip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problemsofdesign ers who have to deal with the complexityofmixed-signal coupling is the lackofveri fication techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuitdesigners must also model coupling through the common substrate when simulating ICs to obtain an accurate estimateofcoupled noise in their designs. Unfortunately, accurate simulationofsubstratecoupling has only recently begun to receive attention andtech niques for the same are not widely known. This bookaddresses two majorissuesofthe mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies someofthe problems that will be encountered, gives examplesofactual hardware experiences, offers simulation te- xxi SIMULATION TECHNIQUES AND SOLUTIONS FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions. 308 pp. Englisch.…

Codice articolo 9781461359425

Titolo
Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits
Autore
Nishath K. Verghese
Editore
Springer US Okt 2012
Anno di pubblicazione
2012
Condizione
Neu
Rilegatura
Taschenbuch
Lingua
inglese
ISBN 10
1461359422
ISBN 13
9781461359425
Peso dell'articolo
470 grammi
Dimensioni
235x155x17 mm

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germania

Venditore con 5 stelle

Venditore AbeBooks dal 11 gennaio 2012

Tariffe di spedizione da Germania a U.S.A.

ArticoloDa 5 a 15 giorni lavorativiDa 5 a 15 giorni lavorativi
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BuchWeltWeit Ludwig Meier e.K.

Germania