Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Dalla quarta di copertina

Solder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

Drawing upon years of practical experience and using numerous examples and illustrative applications, Andrew Perkins and Suresh Sitaraman cover state of the art technologies in solder joint reliability, including:

A comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability,

Useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling, and power cycling enviroments,

New insight into solder joint reliability testing under multiple environments, including vibration environments,

A methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type.

Solder Joint Reliability Prediction for Multiple Environments is a must have book for practitioners and researchers who specialize in solder.

Le informazioni nella sezione "Su questo libro" possono far riferimento a edizioni diverse di questo titolo.

Descrizione libreria

SuperBookDeals.com is your top source for finding new books at the absolute lowest prices, guaranteed ! We offer big discounts - everyday - on millions of titles in virtually any category, from Architecture to Zoology -- and everything in between. Discover great deals and super-savings, on professional books, text book titles, the newest computer guides, or your favorite fiction authors. You'll find it all - at HUGE SAVINGS - at SuperBookDeals. Browse through our complete online product catalog today. Serving customers around the world for years, we help thousands find just the books they're looking for -- at incredibly low, bargain prices.

Visita la pagina della libreria

Informazioni sull?azienda del venditore

Expert Trading Limited
9220 Rumsey Road, Suite 101, Columbia, MD, 21045, U.S.A.

Condizioni di vendita e spedizione

Condizioni di vendita

Company Name: GreatBookPrices
Legal Entity: Expert Trading, LLC
Address: 6310 Stevens Forest, suite 200, Columbia MD 21046
Email address: CustomerService@SuperBookDeals.com
Phone number: 410-964-0026
consumer complaints can be addressed to address above
Registration #: 52-1713923
Authorized representative: Danielle Hainsey

Diritto di recesso

Condizioni di spedizione

Our warehouses across the globe are fully operational without substantial delays. We are working hard and continue to overcome the daily challenges presented by COVID-19. We appreciate your understanding.

Internal processing of your order will take about 1-2 business days. Please allow an additional 4-14 business days for Media Mail delivery. We have multiple ship-from locations - MD,IL,NJ,UK,IN,NV,TN & GA

Tariffe di spedizione da U.S.A. a Italia

Tariffe di spedizione da U.S.A. a Italia
Quantit� dell?ordine	Da 21 a 36 giorni lavorativi	Da 21 a 36 giorni lavorativi
Primo articolo	EUR 17.15	EUR 17.15

I tempi di consegna sono stabiliti dai venditori e variano in base al corriere e al paese. Gli ordini che devono attraversare una dogana possono subire ritardi e spetta agli acquirenti pagare eventuali tariffe o dazi associati. I venditori possono contattarti in merito ad addebiti aggiuntivi dovuti a eventuali maggiorazioni dei costi di spedizione dei tuoi articoli.