Riassunto:
This volu. e chronicles the proceedings of the Sy~osiUM on Surface and Colloid Science in Co~uter Technology held as a part of the 5th International Conference on Surface and Colloid Science, and 59th Colloid and Surface Science Sy~sium sponsored by the Division of Colloid and Surface Cha. istry of the Aaerican Cha. ical Society, and the International Association of Colloid and Interface Scientists at Clarkson University, Potsdam, N. Y. , June 24-28, 1985. Computer technology has many aspects, e. g. , hardlNlare develoPllent, softtNlare developent, and information processing. HoMever, in this Symposium Me Mere exclusively concerned INIith the materials considerations pertaining to microelectronics; surface and colloid science plays a very vital role in the materials aspects of microelectronics/colllputer technology. A complete catalog of instances lNIhere surface and colloid science is important lNIOuld be prohibitively long, so here a fe. eclectic examples should suffice to underscore the importance of interfacial aspects of materials in the INIOnderful INIOrld of computers. As for colloidal phenomena, the dispersion behavior of ceramic polNlders (in making the substrate on lNIhich semiconductor chip is placed) and magnetic particles (for making magnetic tapes and disks) is of critical i~ortance, This calls for fundamental understanding of stability behavior in both aqueous and nonaqueous media, and the INlays to control dispersion characteristics.
Contenuti:
I. Acid-Base Concepts, and Colloidal Dispersions.- Role of Acid-Base Interactions in Inorganic Powder Dispersions and Composites.- The Relevance of Lewis Acid-Base Chemistry to Surface Interactions.- Surface Charge Characteristics of Chromium (IV) Dioxide in Tetrahydrofuran with Special Reference to Magnetic-Ink Dispersions.- Interactions Between Polyelectrolytes and Oxides in Aqueous Suspensions.- Pressure Filtration of Monosized Colloidal Silica.- Sol-Gel Routes to Ceramics and Glasses I. Gels.- II. Adhesion of Films and Coatings Including Resists.- Importance of Interfaces in Microelectronic Device Fabrication.- Role of Silanes in Polymer-Polymer Adhesion.- Infrared and X-Ray Photoelectron Spectroscopy of Thin Silane Films on Iron and Titanium.- Zircoaluminate Coupling Agents as High Performance Adhesion Promoters.- Stresses in Thin Polymeric Films: Relevance to Adhesion and Fracture.- Adhesion and Crosslink Gradient in a Photoresist.- III. Adhesion Aspects of thin Films and Metal-Polymer Interfaces.- Radiation Enhanced Adhesion of Thin Films.- Modification of Silver/Silicon Interfaces During MeV-Ion Bombardment: The Role of an Interfacial Oxide Layer.- Adhesion, Barrier, and Passivation Characteristics of Plasma Polymerized Organic Thin Films.- Nuclear Scattering Profiles of Polyimide-Metal Interfaces.- A Thermodynamic Model for Predicting Formation of Chemical Bonds Between Metals and Cured Polyimides During Metallization.- The Mechanism of Plasma Etching of Polymers and Its Relevance to Adhesion.- Thermal Desorption Study of Physical Forces at the PTFE Surface.- IV. Monolayers and Langmuir-Blodgett Films: Relevance to Microelectronics.- Properties and Applications of Wel1-Tailored Organized Assemblies.- Microlithography with Monolayers and Langmuir-Blodgett Films.- Dry Development of Monolayer-Based Electron-Beam Resists.- Experiments on Langmuir-Blodgett Magnetic Monolayers of Manganese Stearate.- Structural Modifications of L-B Films: Order-Disorder Transitions and Polymerization.- V. Interfacial Aspects in Printing.- Hydrocarbon Based Inks for Electronic Printing.- Effect of Surface Chemistry on the Adhesion of Thermoplastic Polymers to Paper.- Ink/Paper Interactions in Ink Jet Printing (IJP).- About the Contributors.
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