THIN FILM CHEMICAL VAPOR DEPOSITION IN ELECTRONICS EQUIPMENT METHODOLOGY AND THIN FILM GROWTH EXPERIENCE (HB 2014). Questo articolo non è disponibile.THIN FILM CHEMICAL VAPOR DEPOSITION IN ELECTRONICS EQUIPMENT METHODOLOGY AND THIN FILM GROWTH EXPERIENCE (HB 2014)

This monograph is a summary of equipment, methodology and thin film growth experience obtained by the author during his 30 years of research work in the field of Integrated Circuit (IC) device technology. The monograph is concerned with the analysis of different aspects of different types of inorganic thin films grown by Chemical Vapor Deposition (CVD) methods and dedicated to the use in IC technology and production. The author discusses the methodology issues of thin film CVD and the fundamentals of the chemical kinetics of thin film growth. The main core of this monograph is the analysis of thin film CVD kinetics features obtained using different types of reactors, chemical compounds, process conditions. The monograph covers a wide variety of CVD-related aspects: equipment analysis, chemical compound features, CVD process methodology analysis, CVD kinetic features and their quantitative characterization, implementation of obtained numerical equations for thin film step coverage and gap-fill issues, interrelation of the film properties and CVD process features, and CVD process classification. The author would like to highlight that all the data presented in this book has been experimentally obtained by a number of research groups. Most of the data has been double-checked and confirmed. Surely, some data could not be repeated because it was obtained a long time ago using some specific deposition tools and processes. Nevertheless, the author would like to stress that he considers this book as an attempt to create a whole view on the thin film CVD for IC device technology applications. In this regard, the author has tried to generalize a large amount of experimental data, selecting the most common features of the film growth, composition, structure, and properties.