Thermal Management for Opto-electronics Packaging and Applications (Hardcover). Questo articolo non è disponibile.
Lingua: inglese
Editore: John Wiley & Sons Inc, New York, 2024
- Rilegato
- Nuovo

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Venditore AbeBooks dal 29 giugno 2022
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Descrizione dell’articolo da parte del venditore
Hardcover. A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative coolingPractical discussions of thermally enhanced thermal interfacial materials (TIMs)Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…
Codice articolo 9781119179276
- Titolo
- Thermal Management for Opto-electronics Packaging and Applications (Hardcover)
- Autore
- Xiaobing Luo
- Editore
- John Wiley & Sons Inc, New York
- Anno di pubblicazione
- 2024
- Condizione
- new
- Rilegatura
- Hardcover
- Lingua
- inglese
- ISBN 10
- 1119179270
- ISBN 13
- 9781119179276
A systematic guide to the theory, applications, and design of thermal management for LED packaging
In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design.
The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems.
The book also includes:
- A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials
- Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling
- Practical discussions of thermally enhanced thermal interfacial materials (TIMs)
- Complete treatments of hybrid thermal management in downhole devices
Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
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Informazioni sull’autore
Xiaobing Luo, PhD, is a Full Professor at School of Energy and Power Engineering, Huazhong University of Science and Technology, China. He is IEEE Fellow and ASME Fellow. He has extensive research experience in thermal management field. He has published more than 200 academic papers and invented novel micro hydraulic suspension pump for liquid cooling system.
Run Hu, PhD, is a Professor and Doctoral Supervisor at the School of Energy and Power Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Outstanding Youth Scholar and Chutian Scholar awards in Hubei province.
Bin Xie, PhD, is an Assistant Professor at the School of Mechanical Science and Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Natural Science Prize of Hubei Province (second class) and the Outstanding Paper Award from the International Conference on Electronic Packaging Technology (ICEPT).
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